A kind of terminal electrode manufacturing method of laminated chip element
A production method and terminal electrode technology, applied in the direction of transformer/inductor coil/winding/connection, etc., can solve the problems of large loss of components, poor silver-staining, etc., to improve efficiency, solve poor silver-staining, and solve the problem of large product loss Effect
Active Publication Date: 2016-04-20
SUNLORD (SHANGHAI) ELECTRONICS CO
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is: to overcome the defects of poor silver dipping and large component loss in the prior art, and to provide a terminal electrode manufacturing method that can be used for small-sized laminated chip components
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[0021] The present invention will be described in detail below with reference to the accompanying drawings and in combination with preferred specific embodiments.
[0022] This embodiment takes the terminal electrode manufacturing method of 01005 (01005 and below specifications are applicable) laminated chip components as an example, and the specific description is as follows:
[0023] A. The first side of the JIG board is pasted with PET adhesive tape
[0024] Select appropriate low-viscosity PET adhesive tape 1 to paste on the first side of JIG board 2, and use roller 3 to do compression processing, so that PET adhesive tape 1 and JIG board 2 are tightly attached without any space, such as figure 1 shown. This step can use an automatic gluer to improve efficiency.
[0025] B. Implantation of laminated chip components
[0026] Utilize the lead-in version (not shown in the figure), the laminated chip component 4 is implanted into the JIG board 2, and the end face of its fir...
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Abstract
The invention provides a production method for a terminal electrode of a laminated-sheet element. The production method comprises the following steps: A, adhering PET (polyester) gummed paper on the front surface of a JIG plate; B, implanting the laminated-sheet element into the JIG plate, and enabling the end surface of a first end of the laminated-sheet element to be adhered on the PET gummed paper; C, soaking the second end of the laminated-sheet element in silver, and drying the laminated-sheet element; D, transferring the second end of the laminated-sheet element onto polystyrene foam; E, soaking the first end of the laminated-sheet element in silver, and drying the laminated-sheet element, thereby obtaining the laminated-sheet element with two ends soaked with the silver; F, separating the polystyrene foam from the JIG plate; G, separating the laminated-sheet element from the polystyrene foam. Compared with the prior art, the production method has the beneficial effects that by adopting the way that the polystyrene foam is combined with the PET gummed paper, not only can the problem that the terminal electrode is poor for soaking the silver in the production be solved, but also the element can be conveniently separated from a clamp after the terminal electrode is completely produced, and the problem that the loss of the product is large can be solved.
Description
technical field [0001] The invention relates to a method for manufacturing a laminated chip component, in particular to a method for making a terminal electrode of a laminated chip component. Background technique [0002] The terminal electrode manufacturing method of traditional laminated chip components is: use JIG (jig, fixture) board to dip silver, the first and second sides are dipped with PET adhesive tape, 0201 (length and width dimensions are 0.6×0.3 mm) and above, when the chip components with JIG board double-sided sticking PET adhesive paper dipped in silver process, the separation of the product and the tape is achieved by manual tearing of glue, product gravity, product tilt and JIG board hole wall friction, the terminal electrode is due to the strength It is not high, and it is easy to cause the terminal electrode to crack and fall off when it rubs against the hole wall of the JIG plate. 0201 chip components have been smaller and lighter in weight. The JIG boa...
Claims
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IPC IPC(8): H01F27/28
Inventor 陈先仁王清华杨日章
Owner SUNLORD (SHANGHAI) ELECTRONICS CO