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Module structure of support frame on chip

A technology of module structure and support frame, which is applied in the parts of color TV, parts of TV system, TV and other directions, can solve the problems of affecting the imaging quality, the influence of the tilt of the substrate, the influence of the verticality, etc.

Inactive Publication Date: 2014-04-09
LITE ON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The flatness of the substrate will also affect the degree of inclination caused by the two processes
This will affect the perpendicularity between the optical axis of the optical component and the sensing surface of the image sensor, thereby affecting the image quality

Method used

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  • Module structure of support frame on chip
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Embodiment Construction

[0019] The present invention will be described in detail below with examples and accompanying drawings. It should be understood that all the embodiments in the present invention are for illustration only, not for limitation. Therefore, in addition to the embodiments herein, the present invention can also be widely applied in other embodiments. And the present invention is not limited to any embodiment, but should be determined by the appended claims and their equivalents.

[0020] The present invention provides a holder on chip module structure. The module structure utilizes the holder to directly contact the surface of the image sensor to reduce the assembly tilt. In other words, after the support frame, the image sensor and the substrate are assembled, the module structure of the present invention can effectively reduce the inclination angle between the support frame and the image sensor, thereby improving the imaging quality of the image sensor.

[0021] figure 1 A cross...

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Abstract

The invention discloses a module structure of a support frame on a chip. The module structure comprises a first substrate, the chip which is arranged on the substrate and is provided with a sensing region, the support frame which is arranged on the substrate, a transparent substrate which is arranged on the support frame and is roughly aligned with the sensing region, and a lens frame which is arranged on the support frame. A part of the support frame directly contacts the chip, so as to reduce an inclination angle between the chip and the support frame. A lens is fixed in the lens frame and is roughly aligned with the transparent substrate and the sensing region.

Description

technical field [0001] The invention relates to a module structure of a semiconductor component, in particular to a module structure of a support frame on a chip which utilizes the support frame to directly contact the surface of an image sensor to reduce assembly tilt. Background technique [0002] A conventional camera module includes an image sensor and one or more lens groups. The lens group is arranged on the image sensor to reflect the image of the incident light onto the image sensor. The camera module with image sensor can be applied to digital cameras, digital image recorders, mobile phones, smart phones, monitors and other electronic products with camera functions. [0003] In the camera module, as the resolution of the lens module becomes higher and higher, in order to ensure the image quality, various factors affecting the image quality need to be controlled more and more strictly. During module assembly, the displacement and inclination angle of the lens relat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 詹欣达
Owner LITE ON TECH CORP