Image acquisition module and assembly method thereof

Abstract

The invention relates to an image obtaining module and an assembling method thereof. An image sensing chip of an image sensing unit includes a first horizontal upper surface; a reflection substance is placed on a movable lens assembly of an actuator structure movably and temporarily, and includes a second horizontal upper surface; the first horizontal upper surface is parallel with the second horizontal upper surface to improve the assembling flatness of the movable lens assembly relative to the image sensing chip. The distance from a laser source to the first horizontal upper surface is defined as a first vertical distance, the distance from the laser source to the second horizontal upper surface is defined as a second vertical distance, the first vertical distance is subtracted by the second vertical distance to obtain the distance, as a preset fixed focusing distance, from the second horizontal upper surface to the first horizontal upper surface, and thus, the focusing time of the movable lens assembly relative to the image sensing chip is reduced.

Description

technical field [0001] The invention relates to an image acquisition module and an assembly method thereof, in particular to an image acquisition module with increased flatness and reduced focusing time and an assembly method thereof. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Faced with the dual requirements of higher image quality and miniaturization. For the improvement of the picture quality of the imaging module, on the one hand, it is to increase the pixels. The market trend has been improved from the original VGA level of 30 pixels to the current common 2 million pixels, 3 million pixels, and even worse. Introduce a higher level of more than 8 megapixels. In addition to the improvement of pixels, another conc...

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Problems solved by technology

[0004] The embodiment of the present invention is to provide an image acquisition module and its assembly method that increases the flatness and reduces the focusing time, which can effectively solve the problem of "when the image sensor and bracket in the known imaging module use the circuit board as the stacking reference surface When they are stacked sequentially, the angle of assembly of the bracket relative to the image sensor will be too large, resulting in the inability to effectively improve the image quality obtained by the known imaging module.” The artificial focus used will consume a lot of time" defect

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