Image Acquisition Module

Abstract

Disclosed is an image acquisition module. The image acquisition module comprises an image sending unit, a frame shell and an actuator structure. The image sensing unit comprises a carrying substrate and an image sensing chip which is disposed on the carrying substrate and electrically connected to the carrying substrate. The frame shell is disposed on the carrying substrate, and the frame shell downwardly contacts and is attached to the image sensing chip in a flat manner. The actuator structure is disposed on the frame shell and located over the image sensing chip. The actuator structure comprises a lens carrying seat which is disposed on the frame shell and a lens assembly disposed in the lens carrying seat and which downwardly contacts and is attached to the frame shell in a flat manner. So the image sensing chip, the frame shell and the lens assembly are sequentially stacked up, and then an assembling inclined angle of the lens assembly relative to the image sensing chip is reduced.

Description

Technical field [0001] The present invention relates to an image acquisition module, in particular to an image acquisition module for reducing the assembly tilt angle of a lens assembly relative to an image sensing chip. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices, imaging modules have become more common. Faced with the dual requirements of higher picture quality and miniaturization. In view of the improvement of the image quality of the imaging module, on the one hand, it is to increase the pixels. The market trend is from the original VGA-level 30 pixels to the two million pixels and three million pixels that are common on the market, and even worse. Introduced a higher level of more than 8 million pixels. In addition to the improvement of pixels, on the other hand, it ...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention is to provide an image acquisition module for reducing the assembly inclination angle, which can effectively solve the problem of "since the image sensors and sensor brackets in the known image acquisition module are all stacked sequentially with the circuit board as the stacking reference plane." On top of that, the assembly inclination angle of the sensor bracket relative to the image sensor is too large, resulting in the defect that the image quality obtained by the known imaging module cannot be effectively improved”

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