Surface Plasma Treatment of Soft Sheet

Abstract

The invention provides a soft thin plate surface plasma processing structure. The structure comprise a platform which includes a plurality of rollers; two fixed seats which are arranged on the platform and include upper sliding blocks and lower sliding blocks respectively; two electrodes connecting the two fixed seats and arranged on the upper sliding blocks and the lower sliding blocks respectively; guiding plates which include an upper front guiding plate a lower front guiding plate, an upper rear guiding plate and a lower rear guiding plate, are arranged at front and rear sides of the two electrode and fixed by the upper sliding blocks and the lower sliding blocks respectively, each guiding plate being capable of being provided with at least one groove which is combined to a fixed hook or pasted by a heatproof adhesive tape to be fixed to a thermal insulation board, thereby preventing the guiding plates from sagging; the thermal insulation boards which include an upper thermal insulation board and a lower thermal insulation board, are arranged at the other sides of the guiding plates and connected to the guiding plates at an angle, the lower thermal insulation board supporting the lower guiding plate to prevent the guiding plate from sagging and also being capable of being fixed by using an adhesive tape, and the upper thermal insulation board using a fixed hook or a tape to fix the upper guiding plate, so as to prevent the guiding plate from sagging; and transmission shafts which include a front transmission shaft and a rear transmission shaft which are symmetrically arranged at the other sides of the upper thermal insulation board and the lower thermal insulation board to drive the soft thin plate to move.

Description

technical field [0001] The invention relates to a plasma treatment structure on the surface of a soft thin plate. The organic matter and impurities on the soft thin plate are ionized by plasma to clean the surface of the soft thin plate. Background technique [0002] In the manufacturing process of industrial products, there are many processes that usually produce a lot of debris, microchips or small impurities, so it is necessary to clean the surface of the processed products, especially the process of circuit soft boards in the electronic industry. After the board layout is ground, smooth surface roughened, and washed, the surface impurities are cleaned at high temperature. However, when the circuit soft board is sent to the high-temperature treatment structure by rollers, the gap between the rollers and the high-temperature structure is too large, and it is easy to cause damage during transmission. The circuit flexible board falls, or after being transported to the high-t...

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of industrial products, there are many processes that usually produce a lot of debris, microchips or small impurities, so it is necessary to clean the surface of the processed products, especially the process of circuit soft boards in the electronic industry. After the board layout is ground, smooth surface roughened, and washed, the surface impurities are cleaned at high temperature. However, when the circuit soft board is sent to the high-temperature treatment structure by rollers, the gap between the rollers and the high-temperature structure is too large, and it is easy to cause damage during transmission. The circuit flexible board falls, or after being transported to the high-temperature treatment structure, the gap between the circuit flexible board and the roller on the other side is too large, causing the circuit flexible board to fall and cannot pass through the high-temperature treatment structure smoothly; The flexible board is sent to the high-temperature treatment structure, but because it cannot be sent to the processing structure evenly, the circuit flexible board is easy to be folded or twisted, causing damage to the circuit flexible board

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