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Carrier for thin glass substrates and use thereof

A glass substrate and carrier technology, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve problems such as glass damage

Active Publication Date: 2014-05-21
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The trend towards larger and thinner glass can lead to bulging of the glass substrate, which can cause subsequent problems due to the increased possibility of glass damage

Method used

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  • Carrier for thin glass substrates and use thereof
  • Carrier for thin glass substrates and use thereof
  • Carrier for thin glass substrates and use thereof

Examples

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Embodiment Construction

[0019] Reference will now be made in detail to various embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals represent the same elements. In general, only differences between individual embodiments are described. Each example is provided by way of explanation of the invention, and it does not represent a limitation of the invention. Furthermore, features illustrated and described as part of one embodiment can be used on or combined with other embodiments to yield a still further embodiment. The description of the present invention is intended to cover such modifications and variations.

[0020] In general, a substrate, such as a glass substrate, can be secured to a carrier in two essentially different ways. The substrate can be fixed with clamps such as leaf springs, where the substrate is pressed against the carrier frame. Different numbers of diff...

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Abstract

A carrier for supporting a large area glass substrate having an area of at least 0.174 m<2> in a substrate processing chamber is described. The carrier includes at least one fixation element configured to hold the substrate at the substrate's upper side and configured to carry at least 60% of the substrate's weight during processing of the substrate, and at least one support portion adapted to hold the substrate at an essentially vertical orientation during processing of the substrate.

Description

technical field [0001] Embodiments of the invention relate to carriers for substrate processing (eg, for layer deposition) and methods of using the same. Embodiments of the invention relate particularly to carriers, and methods for vertically oriented substrates during processing. More particularly, it relates to carriers for supporting large area substrates in substrate processing machines, apparatus for processing large area substrates, and methods of processing large area substrates. Background technique [0002] There are many methods for depositing materials on substrates. For example, the substrate can be deposited by a physical vapor deposition (Physical Vapor Deposition, PVD) process, a chemical vapor deposition (Chemical Vapor Deposition, CVD) process, a plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process, etc. coating. Generally, the process is performed in a processing tool or chamber where the substrate to be co...

Claims

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Application Information

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IPC IPC(8): C23C14/50
CPCC23C14/50
Inventor A·布吕宁O·海梅尔R·欣特舒斯特H·G·沃尔夫
Owner APPLIED MATERIALS INC