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A kind of synthetic method and application of reactive diluent

A technology of reactive diluent and synthesis method, applied in the directions of adhesives, adhesive types, adhesive additives, etc., can solve the problems of reducing the construction viscosity, reducing the curing bonding strength of the adhesive, and high construction viscosity, and increasing the reaction strength. Effect

Active Publication Date: 2016-04-27
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is two-component packaging, it is usually composed of two parts, curing agent or resin; if it is one-component packaging, it is usually a composition of resin or resin prepolymer and curing agent, but no matter whether it is two-component or one-component, All of them are faced with the technical difficulties of compounding glue. Since the resins are all synthetic polymers or prepolymers, the molecular weight is relatively large, and the construction viscosity is relatively large.
At present, the usual solution on the market is to add some plasticizers or inert diluents that do not participate in chemical reactions. In this way, the construction viscosity is effectively reduced, but at the same time, the curing bonding strength of the adhesive is also reduced.

Method used

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  • A kind of synthetic method and application of reactive diluent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0015] Add an appropriate amount of molecular sieve to 56.628 grams of methyl ethyl ketone oxime (MEKO) to remove water, the water content is 150ppm, after removing water, fill it with nitrogen and store it for later use;

[0016] Put 77 grams of polyether diol (molecular weight 400) into a three-necked flask, vacuum dehydrate at 120±5°C for 2~3 hours, then cool down and fill with nitrogen to store for later use;

[0017] Put 87.075 grams of toluene diisocyanate (2,4-TDI) into a three-necked flask, fill it with nitrogen, and in a nitrogen atmosphere, after heating the temperature to 40°C, start adding methyl ethyl ketone oxime (MEKO) dropwise with a dropping funnel at a rate of 1 drop / second, during the dropping process, the reaction temperature is controlled at 65±2°C, if it is higher than 70°C, the dropwise addition should be stopped immediately, until the methyl ethyl ketoxime (MEKO) is added, continue to react for 2 hours and then cool down;

[0018] When the temperature d...

Embodiment approach 2

[0020] Others are the same as in Example 1, except that the weight of methyl ethyl ketoxime (MEKO) is 57.272 grams, the weight of polyether diol (molecular weight 400) is 88 grams, and the weight of toluene diisocyanate (2,4-TDI) is 87.075 grams.

Embodiment approach 3

[0022] Others are the same as in Example 1, except that the weight of methyl ethyl ketoxime (MEKO) is 60.984 grams, the weight of polyether diol (molecular weight 400) is 66 grams, and the weight of toluene diisocyanate (2,4-TDI) is 87.075 grams.

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Abstract

The invention relates to the technical field of adhesives, in particular to a synthesis method and application of a reactive diluent for thermosetting adhesives. It reacts with toluene diisocyanate (2,4-TDI) and methyl ethyl ketone oxime (MEKO) to block some -NCO groups. The reaction equivalent ratio of TDI and MEKO is set to 1:0.6-0.7, and then use an excess of 10% The designed equivalent polyether diol (molecular weight 400, hereinafter referred to as D400) reacts the remaining -NCO, and after the reaction is completed, a low-viscosity reactive diluent is obtained. The invention provides a low-viscosity active diluent, which can effectively reduce the construction viscosity of the adhesive when added to the adhesive formulation, and participate in chemical reactions to obviously improve the bonding strength of the adhesive.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a synthesis method and application of a reactive diluent for thermosetting adhesives. Background technique [0002] Heat-curing adhesives are an important part of adhesives, and their chemical types include epoxy, polyurethane, etc., and their packaging forms include two-component types and one-component types. If it is two-component packaging, it is usually composed of two parts, curing agent or resin; if it is one-component packaging, it is usually a composition of resin or resin prepolymer and curing agent, but no matter whether it is two-component or one-component, All of them are faced with the technical difficulties of compounding glue, because the resins are all synthetic polymers or prepolymers, the molecular weight is relatively large, and the construction viscosity is relatively high. The usual solution currently on the market is to add some plasticizers or inert dil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/80C08G18/48C09J163/00C09J11/08
CPCC08G18/4825C08G18/8077C09J11/06
Inventor 许愿王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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