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Synthetic method and application of active diluent

A reactive diluent and synthesis method technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve the problems of reducing construction viscosity, reducing adhesive curing bonding strength, high construction viscosity, etc., and achieve the goal of increasing reaction strength Effect

Active Publication Date: 2014-06-11
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is two-component packaging, it is usually composed of two parts, curing agent or resin; if it is one-component packaging, it is usually a composition of resin or resin prepolymer and curing agent, but no matter whether it is two-component or one-component, All of them are faced with the technical difficulties of compounding glue. Since the resins are all synthetic polymers or prepolymers, the molecular weight is relatively large, and the construction viscosity is relatively large.
At present, the usual solution on the market is to add some plasticizers or inert diluents that do not participate in chemical reactions. In this way, the construction viscosity is effectively reduced, but at the same time, the curing bonding strength of the adhesive is also reduced.

Method used

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  • Synthetic method and application of active diluent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0015] Add an appropriate amount of molecular sieve to 56.628 grams of methyl ethyl ketone oxime (MEKO) to remove water, the water content is 150ppm, after removing water, fill it with nitrogen and store it for later use;

[0016] Put 77 grams of polyether diol (molecular weight 400) into a three-necked flask, vacuum dehydrate at 120±5°C for 2~3 hours, then cool down and fill with nitrogen to store for later use;

[0017] Put 87.075 grams of toluene diisocyanate (2,4-TDI) into a three-necked flask, fill it with nitrogen, and in a nitrogen atmosphere, after heating the temperature to 40°C, start adding methyl ethyl ketone oxime (MEKO) dropwise with a dropping funnel at a rate of 1 drop / second, during the dropping process, the reaction temperature is controlled at 65±2°C, if it is higher than 70°C, the dropwise addition should be stopped immediately, until the methyl ethyl ketoxime (MEKO) is added, continue to react for 2 hours and then cool down;

[0018] When the temperature d...

Embodiment approach 2

[0020] Others are the same as in Example 1, except that the weight of methyl ethyl ketoxime (MEKO) is 57.272 grams, the weight of polyether diol (molecular weight 400) is 88 grams, and the weight of toluene diisocyanate (2,4-TDI) is 87.075 grams.

[0021]

Embodiment approach 3

[0023] Others are the same as in Example 1, except that the weight of methyl ethyl ketoxime (MEKO) is 60.984 grams, the weight of polyether diol (molecular weight 400) is 66 grams, and the weight of toluene diisocyanate (2,4-TDI) is 87.075 grams.

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Abstract

The invention relates to the technical field of adhesives, in particular to a synthetic method and application of an active diluent for a hot setting adhesive. The method comprises the following steps: reacting toluene diisocynate (2,4-TDI) with methyl ethyl ketoxime (MEKO) to block a part of -NCO groups, wherein the reaction equivalence ratio of TDI to MEKO is set to 1:(0.6-0.7); removing the remaining -NCO by using polyether glycol (which is 400 in molecular weight, and is called D400 for short) by reacting in an amount which is 10 percent higher than the designed equivalence to obtain a low-viscosity active diluent. By adding the low-viscosity active diluent provided by the invention into an adhesive formula, the construction viscosity of the adhesive can be lowered effectively. Moreover, the diluent participates in chemical reactions, so that the bonding strength of the adhesive can be enhanced remarkably.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a synthesis method and application of a reactive diluent for thermosetting adhesives. Background technique [0002] Heat-curing adhesives are an important part of adhesives, and their chemical types include epoxy, polyurethane, etc., and their packaging forms include two-component types and one-component types. If it is two-component packaging, it is usually composed of two parts, curing agent or resin; if it is one-component packaging, it is usually a composition of resin or resin prepolymer and curing agent, but no matter whether it is two-component or one-component, All of them are faced with the technical difficulties of compounding glue, because the resins are all synthetic polymers or prepolymers, the molecular weight is relatively large, and the construction viscosity is relatively high. The usual solution currently on the market is to add some plasticizers or inert dil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/80C08G18/48C09J163/00C09J11/08
CPCC08G18/4825C08G18/8077C09J11/06
Inventor 许愿王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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