Acetone-removing silicon rubber and preparation method thereof

Abstract

The invention relates to acetone-removing silicon rubber and a preparation method thereof. The acetone-removing silicon rubber consists of the following raw materials in part by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 20 to 50 parts of plasticizer, 500 to 1,000 parts of spherical heat-conducting stuffing, 1 to 5 parts of needle-like heat-conducting stuffing, 5 to 10 parts of acetone-removing type crosslinker, 6 to 10 parts of white carbon black, 1 to 2 parts of tackifier and 0.5 to 2 parts of organic guanidine catalyst. The preparation method of the acetone-removing silicon rubber comprises the following steps of: weighing a proper amount of the hydroxyl-terminated polydimethylsiloxane, the plasticizer, the spherical heat-conducting stuffing, the needle-like heat-conducting stuffing, the acetone-removing type crosslinker, the white carbon black, the tackifier and the organic guanidine catalyst; adding the weighed materials into a stirrer in sequence; and vacuuming the stirrer and mixing the materials. The acetone-removing silicon rubber and the preparation method thereof have the advantages that: on the basis of the use of the acetone-removing type crosslinker, by combining the spherical heat-conducting stuffing and the needle-like heat-conducting stuffing, the heat conductivity of a product is improved, and a heat-conducting coefficient is up to more than 2.5W / K.m.

Description

technical field [0001] The invention relates to a silicone rubber, in particular to acetone-free silicone rubber and a preparation method thereof. Background technique [0002] Today, with the rapid development of electronic technology, electronic products have penetrated into every corner. The functions of portable electronic products are becoming more and more powerful, requiring chips to be smaller and smaller, while power is getting bigger and bigger. Chip heat dissipation has become a key factor in the service life of electronic products. At present, the main heat dissipation method of the chip is to install a copper or aluminum heat sink on the chip, and use the good thermal conductivity of the heat sink itself and the appropriate heat dissipation area to achieve the heat dissipation effect of the chip. However, it is impossible to have 100% contact between the chip and the heat sink, and the thermal conductivity of air is only 0.02W / K·m, so a filling medium with exc...

AI Technical Summary

Problems solved by technology

With the gradual increase of chip power, thermal conductivity products in this range of thermal conductivity can no longer meet the requirements of use.

The acetone-free silicone rubber with high thermal conductivity mainly relies on imports. For example, Shin-Etsu’s product named KE-3467 has a thermal conductivity of 2.4W / K m, but it is expensive and the supply is not timely.

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