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Light emitting diode packaging structure and manufacturing method thereof

A technology of light-emitting diodes and packaging structures, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve problems that affect the light-emitting efficiency of light-emitting diode packaging structures and the inability to use the light source efficiently.

Active Publication Date: 2016-12-28
LEXTAR ELECTRONICS CORP
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  • Abstract
  • Description
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Problems solved by technology

[0003] However, at present, when the light-emitting diode is emitting light, part of the light source emitted by the light-emitting diode chip will be blocked by the substrate or the housing and cannot be used as a lighting function, so that the light source emitted by the light-emitting diode chip cannot be used efficiently, thereby affecting Overall light extraction efficiency of light emitting diode packaging structure

Method used

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  • Light emitting diode packaging structure and manufacturing method thereof
  • Light emitting diode packaging structure and manufacturing method thereof
  • Light emitting diode packaging structure and manufacturing method thereof

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Embodiment Construction

[0038] The spirit of the present invention will be described in detail with the accompanying drawings. Anyone with ordinary knowledge in the technical field can change and modify it by the technology taught in the present invention after understanding the preferred embodiments of the present invention without departing from it. spirit and scope of the invention.

[0039] Please refer to figure 1 , which shows a cross-sectional view of a light emitting diode packaging structure 100 according to an embodiment of the present invention. Such as figure 1 As shown, a LED packaging structure 100 includes a casing 110 , two conductive supports 120 , a LED chip 130 and a transparent packaging compound 140 .

[0040] The casing 110 forms a reflection groove 112 . The two conductive brackets 120 are disposed in the housing 110 and partially exposed in the reflective groove 112 . Wherein, the two conductive brackets 120 are separated by an insulator 122 . In this embodiment, the insu...

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Abstract

The invention discloses a packaging structure of a light-emitting diode and a manufacturing method thereof. The packaging structure of the light-emitting diode comprises a housing, two electrically-conductive supports, a light-emitting diode chip and light-transmitting package colloid. The housing comprises a reflecting groove. The two electrically-conductive supports are arranged in the housing and partially exposed to the reflecting groove. The light-emitting diode chip is arranged in the reflecting groove and electrically connected to the two electrically-conductive supports via guide wires and is not in contact with the bottom surface of the reflecting groove so that a gap is kept. The light-transmitting package colloid is arranged in the reflecting groove and covers the guide wires and the light-emitting diode chip and fills up the gap.

Description

technical field [0001] The present invention relates to a packaging structure and a manufacturing method thereof, and in particular to a light emitting diode packaging structure and a manufacturing method thereof. Background technique [0002] A light-emitting diode (Light-Emitting Diode, LED) is a semiconductor element. In the early days, light-emitting diodes were mostly used as light-emitting elements of indicator lights or display panels, but with the rapid development of the technology of making light-emitting diodes, they have been widely used in lighting equipment in recent years. In addition, when the lamp uses light-emitting diodes and light guide plates to emit light, it has the advantages of high efficiency, long life, and less damage compared with traditional bulb light sources. [0003] However, at present, when the light-emitting diode is emitting light, part of the light source emitted by the light-emitting diode chip will be blocked by the substrate or the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48
CPCH01L2224/48091H01L2224/49107H01L2224/73265H01L2224/92247
Inventor 林升霈许哲铭
Owner LEXTAR ELECTRONICS CORP
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