Splitting device and splitting method

Abstract

The invention provides a cutting device and a cutting method. The device can cut cutting predetermined lines of a chip supported in the inside of a cyclic frame with a suitable size corresponding to the chip (a round plate) by a belt body through strip parts and the strip parts cannot intervene with the cyclic frame. A strip unit (50) has a first strip part (51) which is longer than the shortest line of the cutting predetermined lines of the chip (1) and shorter than the longest line and a second strip part (52) which is longer than the longest line. The strip unit moves relative to the chip along the direction vertical to the cutting predetermined lines in a state that the strip parts and the cutting predetermined lines are parallel. The cutting predetermined line of the outer region of the chip is broken through the first strip part (51), the cutting predetermined line of the central region of the chip is broken through the second strip part (52) and therefore the chip is cut. The interference of the strip part and the cyclic frame (7) is prevented through the different strip parts with lengths corresponding to the lengths of the cutting predetermined lines.

Description

technical field [0001] The present invention relates to a dividing device and a dividing method for dividing a circular plate-shaped object such as a semiconductor wafer along a predetermined dividing line. Background technique [0002] In the semiconductor device manufacturing process, the surface of a disc-shaped semiconductor wafer is divided into a plurality of rectangular areas by grid-shaped dividing lines, and ICs (integrated circuits) and LSIs (large-scale integrated circuits) are formed on the surfaces of these rectangular areas. and other electronic circuits, and then perform necessary processing such as grinding after grinding the back surface, and then divide the wafer into rectangular areas along the planned dividing line, thereby obtaining a plurality of semiconductor chips. [0003] As a method of dividing a circular plate-shaped object such as a semiconductor wafer, a method has been proposed in which an external force is applied to the circular plate-shaped ...

AI Technical Summary

Problems solved by technology

When using a strip-shaped member (strip member) along the planned dividing line to apply external force to the planned dividing line to divide the circular plate (supported inside the ring frame through the belt as described above), the strip The member needs to have a length longer than the diameter of the circular plate. However, when such a bar member is applied to the planned division line of the outer region of the circular plate, the bar interferes with the ring frame and external force cannot be applied.

Therefore, it is necessary to make the opening size of the inner side of the ring frame large enough not to contact the bar member, and such a large ring frame is too large for a circular plate, thus resulting in the use of an improperly sized frame.

[0008] If a ring frame that is too large in size is used for the circular plate, the belt body that is a consumable must also be increased to match the size of the ring frame, and the usage of the belt body increases, resulting in uneconomical costs. question

In addition, processing equipment used in processes other than division, such as the division starting point formation process and the pick-up process for picking up the divided chips, requires the use of a ring-shaped frame with a size corresponding to a circular plate-shaped object. Therefore, only for the division process On the other hand, it is necessary to transfer the circular plate to the oversized ring frame, which is very troublesome and reduces productivity.

In addition, for example in the present situation, when the circular plate is the largest diameter wafer, there is also the problem of having to make a larger annular frame specially adapted to this wafer, i.e. not interfering with the bar parts

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