Substrate-free heat-conducting double-faced adhesive tape

A technology of thermally conductive double-sided adhesive without base material, which is applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., and can solve the problem of poor heat dissipation, shortened life, and no base material of electronic products. Problems such as poor thermal conductivity of double-sided adhesive tape, to achieve the effect of convenient processing and use, easy to paste, and low price

Inactive Publication Date: 2014-06-25
TAICANG TAIBANG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Non-substrate thermally conductive double-sided adhesive tape is a kind of tape that is directly coated on the release paper without coating any substrate. It has excellent waterproof performance, good processability, good temperature resistance, dimensional stability, Good thermal stability, chemical stability, good initial tack and long-lasting tack, etc., are widely used in the electronics industry. Due to the poor thermal conductivity of existing double-sided adhesives without substrates, electronic products have poor heat dissipation capabilities and shortened lifespans.

Method used

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  • Substrate-free heat-conducting double-faced adhesive tape

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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] see figure 1 , the embodiment of the present invention includes:

[0015] A heat-conducting double-sided adhesive without base material, comprising: an adhesive tape 2 and a release film 1, the release film 1 is arranged on both sides of the adhesive tape 2, and the adhesive tape 1 is composed of a colloidal matrix and a heat-conducting material 3.

[0016] The colloid matrix is ​​silicone pressure-sensitive adhesive, and the heat-conducting material 3 is silver powder and carbon powder, which has good heat c...

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Abstract

The invention discloses a substrate-free heat-conducting double-faced adhesive tape which comprises an adhesive tape and release films, wherein both sides of the adhesive tape are provided with the release films; the adhesive tape is composed of a colloid matrix and a heat-conducting material; and the colloid matrix is pressed into a sheet. The substrate-free heat-conducting double-faced adhesive tape has the advantages of high reliability, favorable heat conductivity, high temperature resistance, low price and the like, is convenient to manufacture, easy for adhesion and convenient die cutting, and has wide market prospects in electronic industry.

Description

technical field [0001] The invention relates to the field of adhesive tapes, in particular to a substrate-free heat-conducting double-sided adhesive. Background technique [0002] Non-substrate thermally conductive double-sided adhesive tape is a kind of tape that is directly coated on the release paper without coating any substrate. It has excellent waterproof performance, good processability, good temperature resistance, dimensional stability, Good thermal stability, chemical stability, good initial tack and long-lasting tack, etc., are widely used in the electronics industry. Due to the poor thermal conductivity of existing double-sided adhesives without substrates, electronic products have poor heat dissipation capabilities and shorten their lifespan. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a thermally conductive double-sided adhesive without base material, which can improve the thermal conductivity ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J183/04C09J11/04
Inventor 曹群
Owner TAICANG TAIBANG ELECTRONICS TECH
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