Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor cooling and heating device with cooling fin and heating fin and application method of semiconductor cooling and heating device assembled in spraying air purifier

An air purification device, semiconductor technology, used in refrigeration and liquefaction, chemical instruments and methods, refrigerators, etc.

Inactive Publication Date: 2014-07-09
梁嘉麟
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Propose a simple device and method to solve the follow-up treatment of high humidity air purification after water dedusting
——Using the dual effect of P-N junction semiconductor cooling and heating devices with the simplest structure to solve the above unsatisfactory problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor cooling and heating device with cooling fin and heating fin and application method of semiconductor cooling and heating device assembled in spraying air purifier
  • Semiconductor cooling and heating device with cooling fin and heating fin and application method of semiconductor cooling and heating device assembled in spraying air purifier
  • Semiconductor cooling and heating device with cooling fin and heating fin and application method of semiconductor cooling and heating device assembled in spraying air purifier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] figure 1 and figure 2 It just shows the structural principle of the semiconductor cooling and heating device W that can perform cooling work and heating work respectively through the cooling heat conduction fin 6 and the heat conduction fin 7 at the same time. ——The well-known common sense: as long as the P-N junction semiconductor device p-n is fed with direct current, the refrigeration effect and the heating effect can be produced respectively at different positions thereof, and the core of the present invention is to utilize its cold and thermal dual effects simultaneously.

[0025] Explain one point: the application of P-N junction semiconductor device p-n on refrigeration engineering (its heat production is abandoned) or heating engineering (its cold production is abandoned) is a quite mature matter, so the thermodynamic calculation problem involved in the present invention is omitted here .

[0026] If the air purification level that the present invention inten...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor cooling and heating device with a cooling fin and a heating fin and an application method of the semiconductor cooling and heating device assembled in a spraying air purifier. The semiconductor cooling and heating device is characterized in that heat exchange fins are arranged at the lower cooling end and the upper heating end of a same P-N node semiconductor device (p-n) respectively to form the semiconductor cooling and heating device (W) with the cooling fin (6) and the heating fin (7). The key application method, namely the structural connection requirement during assembly, includes connecting a cooling channel section (D-1) formed by a portion, provided with the cooling fin (6), of the semiconductor cooling and heating device (W) with an air purification channel (D) comprising a raining area formed by a water forming plate (2) and a water collecting plate (5); connecting a heating channel section (D-2) formed by a portion, provided with the heating fin (7), of the semiconductor cooling and heating device (W) with an air purification channel (D) provided with a fan driver (1). The one-body two-effect characteristic that one side of the semiconductor device (p-n) cools and the other side thereof heats after the semiconductor device (p-n) is electrified is utilized, so that conditions are created for remarkable simplification of cooling and heating facilities (size reduction) and remarkable energy conservation.

Description

technical field [0001] The invention relates to a semiconductor cooling and heating device provided with cooling fins and heating fins and a method for using it in a water shower air purification device. Background technique [0002] At present, the conventional air purification technology is mainly realized by using air filters capable of achieving different degrees of filtration to perform single-level or multi-level filtration of dust particles with different diameters. ——Generally, industrial purification requirements can reach 100,000 / cubic feet, that is, a dust particle diameter of 0.5 microns is quite good. [0003] However, the ever-growing demand for air purification requirements in many technical fields is constantly rising, and it has become more and more difficult to rely on air filters to implement multi-level purification and filtration. [0004] Under normal circumstances, after a heavy rain, the outdoor air will become extraordinarily fresh, and the visibili...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F25B21/02B01D47/00
Inventor 梁嘉麟
Owner 梁嘉麟
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com