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Air purification device with water spraying as main part and semiconductor refrigeration thermal effect as auxiliary part

A technology of air purification and semiconductor, applied in the field of air purification

Inactive Publication Date: 2015-10-14
梁嘉麟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The simplest method is proposed to solve the follow-up treatment of air purification after water dedusting

Method used

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  • Air purification device with water spraying as main part and semiconductor refrigeration thermal effect as auxiliary part
  • Air purification device with water spraying as main part and semiconductor refrigeration thermal effect as auxiliary part

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Embodiment Construction

[0022] Well-known common sense: as long as direct current is passed through the "P-N" junction semiconductor device P-N, the cooling effect and heating effect can be generated on its front and back sides respectively. The core of the present invention is based on the two The key feature that the side of the direct current power supply can produce cooling effect and heating effect respectively at the same time leads to the idea of ​​realizing the solution of the present invention with the smallest device volume and substantial energy saving effect.

[0023] Note: the application of "P-N" junction semiconductor device P-N in refrigeration engineering (its heat production is abandoned) or heating engineering (its cold production is abandoned) is a very mature matter, so the thermodynamic calculation problem involved in the present invention is here omitted.

[0024] The air purification level that the present invention intends to realize should be the highest, and this just must ...

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Abstract

The invention discloses a method for using a semiconductor heating-cooling device in water-spraying air purification equipment. The semiconductor heating-cooling device is structurally formed by that heat exchange fins are arranged at the lower cold ends and upper hot ends of a same group of P-N-node semiconductor devices (p-n) to form the semiconductor heating-cooling device (W) with refrigerating fins (6) and heating fins (7). The key utilization method, namely structural cohesion requirements in utilization includes: enabling a refrigerating passage formed by a portion, with the refrigerating fins (6), of the semiconductor heating-cooling device (W) to join with a rain area air purification passage (D) formed by a water storage plate (2) and a water receiving plate (5); enabling a heating passage (D-2) formed by a portion, with the heating fins (7), of the semiconductor heating-cooling device (W) to join with an air purification passage (D) with a fan driver (1). By taking the advantage of double effects of the semiconductor devices (p-n) with one side for refrigerating and the other side for heating after electrification, conditions are created for both greatly simplifying heating-cooling facilities (size reduced) and greatly saving energy.

Description

technical field [0001] The invention relates to air purification technology, in particular to an air purification device technology mainly based on water shower and supplemented by semiconductor cooling and heating effect. Background technique [0002] At present, the conventional air purification technology is mainly realized by using air filters capable of achieving different degrees of filtration to perform single-level or multi-level filtration of dust particles with different diameters. ——Generally, industrial purification requirements can reach 100,000 / cubic feet, that is, a dust particle diameter of 0.5 microns is quite good. [0003] However, the ever-growing demand for air purification requirements in many technical fields is constantly rising, and it has become more and more difficult to rely on air filters to implement multi-level purification and filtration. [0004] Under normal circumstances, after a heavy rain, the outdoor air will become extraordinarily fres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24F5/00B01D47/06
CPCF24F5/0042F25B21/02F24F8/10F24F8/117
Inventor 梁嘉麟
Owner 梁嘉麟
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