Application method for semiconductor cooling and heating device cooperatively used in water spray air cleaning unit

An air purification device and semiconductor technology, which are applied in the fields of water spray air purification devices and semiconductor heating and cooling devices

Inactive Publication Date: 2014-09-10
CHINA JILIANG UNIV
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Propose a simple device and method to solve the follow-up treatment of high humidity air purification after water dedusting
——Using the dual effect of the simplest structure P-N junction semiconductor cooling and heating devices to solve the above unsatisfactory problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Application method for semiconductor cooling and heating device cooperatively used in water spray air cleaning unit
  • Application method for semiconductor cooling and heating device cooperatively used in water spray air cleaning unit
  • Application method for semiconductor cooling and heating device cooperatively used in water spray air cleaning unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] figure 1 and figure 2 It just shows the structural principle of the semiconductor cooling and heating device W that can perform cooling work and heating work respectively through the cooling heat conduction fin 6 and the heat conduction fin 7 at the same time. ——The well-known common sense: as long as direct current is passed on to p-n junction semiconductor device p-n, cooling effect and heating effect can be produced respectively on its different positions simultaneously, and the core of the present invention just utilizes its cold and hot double effect simultaneously.

[0028] Explain one point: the application of p-n junction semiconductor device p-n on refrigeration engineering (its heat production is abandoned) or heating engineering (its cold production is abandoned) is quite mature matter, so the thermodynamic calculation problem that the present invention relates here omitted.

[0029] If the air purification level that the present invention intends to reali...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an application method for a semiconductor cooling and heating device cooperatively used in a water spray air cleaning unit. The semiconductor cooling and heating device with a cooling fin (6) and a heating fin (7) is constructed by respectively arranging heat exchange fins on a lower cooling end and an upper heating end of a same set of P-N knot semiconductor device (p-n). The key application method, i.e., requirements on structure connection during cooperative usage of the semiconductor cooling and heating device and the water spray air cleaning unit, is that the part of the semiconductor cooling and heating device (W) provided with the cooling fin (6) is allowed to form a cooling passage section (D-1) which is connected with a deluge area cleaning air passage (D) composed of a water forming tray (2) and a water collecting tray (5) and the part of the semiconductor cooling and heating device (W) provided with the heating fin (7) is allowed to form a heating passage section (D-2) which is connected with an air cleaning passage (D) equipped with a fan driver (1). Since the integrated double-effect characteristic that the semiconductor device (p-n) realizes cooling at one side and heating at the other side after energization is employed, conditions are created for substantial simplification of a cooling and heating facility (reduction in size) and substantial conservation of energy.

Description

technical field [0001] The invention relates to an application method in which a semiconductor cooling and heating device provided with cooling fins and heating fins is used in a water shower air purification device. Background technique [0002] At present, the conventional air purification technology is mainly realized by using air filters capable of achieving different degrees of filtration to perform single-level or multi-level filtration of dust particles with different diameters. ——Generally, industrial purification requirements can reach 100,000 / cubic feet, that is, a dust particle diameter of 0.5 microns is quite good. [0003] However, the ever-growing demand for air purification requirements in many technical fields is constantly rising, and it has become more and more difficult to rely on air filters to implement multi-level purification and filtration. [0004] Under normal circumstances, after a heavy rain, the outdoor air will become extraordinarily fresh, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B01D47/00F25B21/02
Inventor 黄铁群
Owner CHINA JILIANG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap