A Position Synchronization Method for Defect Detection and Observation Equipment

Abstract

The invention provides a position synchronizing method of defect detection and observation devices, relating to the technical field of semiconductor detection. The method comprises the steps that a reference wafer with a defect is provided; the defect detection device detects the reference wafer, and the defect observation device observes the defect, and corrects a defect observation program according to a first deviation value; after a set time interval, the defect detection and observation devices respectively detects and observes the defect of the reference wafer again to obtain a second deviation value of the central positions of the defect detection and observation devices; and the first deviation value is corrected and updated according to the second deviation value. According to technical scheme of the invention, the central positions of the defect detection and observation devices are kept consistent, thereby avoiding failure of automatic observation due to great difference between the defect detection and observation devices.

Description

technical field [0001] The invention relates to the field of semiconductor detection technology, in particular to a method for position synchronization of defect detection and observation equipment. Background technique [0002] The manufacturing process of integrated circuits is very complicated. Simply put, it is to use various methods to form different "layers" on the substrate material (such as silicon substrate), and to dope ions in selected areas to change the semiconductor material. Conductive properties, the process of forming semiconductor devices. The manufacturing process of integrated circuits is composed of a variety of individual processes. Simply put, the main individual processes usually include three categories: thin film preparation process, pattern transfer process and doping process. [0003] In order to meet the computing requirements of the complex functions of the chip, the critical dimensions of the circuit graphics on the chip are continuously reduc...

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