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Topology construction method of high-density server and system thereof

A high-density server and sub-server technology, which is applied in the topology construction method and system field of high-density servers, can solve problems such as not being able to meet the high-throughput requirements of data center applications, and achieve saving of manufacturing costs, time costs, and good fault tolerance Effect

Active Publication Date: 2014-09-03
INST OF COMPUTING TECH CHINESE ACAD OF SCI
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Problems solved by technology

[0007] However, for existing systems such as the SiCortex SC5832, a server consisting of 6 processor chips cannot meet the high throughput requirements of data center applications

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  • Topology construction method of high-density server and system thereof
  • Topology construction method of high-density server and system thereof
  • Topology construction method of high-density server and system thereof

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Embodiment Construction

[0027] The present invention will be described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] According to an embodiment of the present invention, a high-density server topology construction method is provided. Wherein, the high-density server is composed of multiple sub-servers (such as blade servers), and each sub-server includes multiple switching chips. Briefly, the topology construction method includes: creating a Kautz directed graph and dividing it to obtain multiple isomorphic subgraphs; arranging switching chips in each subserver according to the isomorphic subgraph; and connecting multiple such sub-servers to form a high-density server, so that the topology of the high-density server is consistent with the created Kautz Figure 1 Sincerely. now refer to figure 1 , detailing...

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Abstract

The invention provides a topology construction method of a high-density server and a system thereof. The method comprises the following steps: a Kautz digraph for a topological structure of a high-density server is created according to requirements on network size, and the Kautz digraph is divided into multiple isomorphic sub-graphs; and switch chips are arranged on a subserver according to the isomorphic sub-graphs, and multiple subservers are arranged in the high-density server according to the Kautz digraph such that the switch chips on the multiple subservers are corresponding to nodes in the Kautz digraph one to one and the connection mode between the switch chips is consistent with the connection mode between the corresponding nodes in the Kautz digraph. Based on the Kautz digraph, the subservers with the same topological structure are used to form the high-density server. Thus, the high-density server has characteristics of high efficiency, good fault tolerance and extendibility. In addition, batch production of the subservers can be realized, thus saving manufacturing cost and time cost.

Description

technical field [0001] The invention relates to the field of topology design of a data center network, in particular to a high-density server topology construction method and system. Background technique [0002] With the increasing popularity of cloud computing, how to build a data center network with better fault tolerance and higher efficiency has become a current research hotspot. Due to the good properties of Kautz network in node scale, path length and fault tolerance, it has been widely used as the topology of data center network. Taking the SiCortex SC5832 system as an example, the system forms a large point (that is, a server) with 6 processor chips, and connects 972 such large points into a kautz network (or Kautz network) with a diameter of 6 and a degree of 3. directed graph). [0003] Generally speaking, a Kautz directed graph can be written as K(d, n), which means that the out-degree and in-degree of nodes are both d (d≥2) and the network diameter is n (n≥1)....

Claims

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Application Information

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IPC IPC(8): H04L12/28H04L12/24
CPCY02B60/31Y02D30/50
Inventor 包雯韬付斌章陈明宇张立新
Owner INST OF COMPUTING TECH CHINESE ACAD OF SCI
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