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Semiconductor die carrier structure and method of manufacturing same

A technology of semiconductor tubes and semiconductors, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as the lack of standardized methods for packaging design

Inactive Publication Date: 2014-12-31
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing methods to deal with die debonding and / or die cracking are specific to a particular package design and there is no standardized method for any package design

Method used

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  • Semiconductor die carrier structure and method of manufacturing same
  • Semiconductor die carrier structure and method of manufacturing same
  • Semiconductor die carrier structure and method of manufacturing same

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Embodiment Construction

[0018] The following detailed description refers to the accompanying drawings that show, by way of illustration, specific details and embodiments in which the invention may be practiced.

[0019] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Embodiments or designs described herein as "exemplary" are not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0020] The term "over?" used with respect to a deposited material formed on a side or surface "over?" may be used herein to mean that the deposited material may be "formed directly on" the implied side or surface on?” (e.g. in direct contact with it). The term "over?" used in relation to a deposited material formed on a side or surface "over?" may be used herein to mean that the deposited material may be disposed in one or more additional layers implicitly "Indirectly formed on an implied side or surface??"

[0021] figure 2 A flow...

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PUM

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Abstract

Disclosed are a semiconductor die carrier structure and a method of manufacturing the same. Various embodiments provide a method of manufacturing a semiconductor die carrier structure. The method may include providing a die pad configured to carry a semiconductor die thereon; and bending at least one portion of the die pad, wherein the at least one bent portion extends across the die pad.

Description

technical field [0001] Various embodiments relate generally to semiconductor die carrier structures, methods of fabricating semiconductor die carrier structures, and semiconductor packages. Background technique [0002] In semiconductor packaging, a die or chip is typically mounted on a die pad that mechanically supports the die or chip thereon. [0003] Figure 1A A die paddle 100 (also referred to as a die paddle or die mount paddle) is shown, which has a flat surface for supporting the die. Such as Figure 1B As shown in the side view of , die 102 is mounted on a flat surface of die pad 100 . Die 102 may be attached to the surface of die pad 100 by a die attach material, such as by an adhesive. Die 102 and die pad 100 may be encapsulated with an encapsulation material to form a semiconductor package. [0004] In IC (Integrated Circuit) packages, Figure 1A with Figure 1B The die 102 and die pad 100 may suffer from die debonding problems and / or die cracking problems,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/495
CPCH01L23/49503H01L23/49548H01L23/49579H01L2924/0002Y10T29/49121H01L2924/00
Inventor 蔡志明
Owner INFINEON TECH AG