Method for predicting influence of dynamic compaction on soil body and surrounding environment
A surrounding environment and soil technology, applied in the field of foundation soil survey, construction, basic structure engineering, etc., can solve problems such as complex determination, difficult numerical calculation models, and complex problems in nonlinear contact analysis, achieving high precision, Kinetic Model Simple Effects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0049] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the present invention, and detailed implementation and specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments.
[0050] Due to the high rigidity of the rammer itself, the tamping construction process (such as figure 1 ) in the deformation and horizontal displacement and inclination of the rammer, that is, under the premise of only considering the vertical displacement of the rammer (the penetration depth of the rammer), it is assumed that the vertical displacement of the rammer in the soil layer increases linearly with the number of ramming (Such as figure 2 ). Based on this, two dynamic models of the entire construction process of the interaction between the tamper and the soil are proposed, n...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com