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Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same

A technology for printed circuit boards and arrays, which is applied in the structural connection of printed circuits, multi-layer circuit manufacturing, printed circuit components, etc., and can solve problems such as time-consuming productivity and reduction

Active Publication Date: 2015-03-25
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when an electronic device is manufactured using a repaired array PCB, testing for the electronic device should be performed after each single PCB is separated from the repaired array PCB, so testing the array PCB for the electronic device is time-consuming and yield decreases

Method used

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  • Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
  • Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
  • Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same

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Embodiment Construction

[0055] Reference will now be made to the exemplary embodiments, examples of which are illustrated in the accompanying drawings, to help those skilled in the art understand the structure and principles of the inventive concept. However, the inventive concept is not limited to the embodiments set forth hereinafter. Rather, the embodiments disclosed herein are provided to provide an easy and complete understanding of the scope and spirit of the inventive concept. In the drawings, the size and shape of elements may be exaggerated for clarity, and dimensional ratios between individual elements may be exaggerated, which may be larger or smaller than actual values.

[0056] It will be understood that when an element such as a layer, region or substrate is referred to as being "on," "connected to" or "coupled to" another element, it can be directly on, connected to, or coupled to the other element. One element, or intervening elements may be present. In contrast, when an element is ...

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Abstract

An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.

Description

technical field [0001] The inventive concept disclosed herein relates to an array printed circuit board (PCB), a method of replacing a defective PCB of the array PCB, and a method of manufacturing an electronic device using the array PCB. More particularly, the inventive concept provides an array PCB in which a defective PCB is easily replaced, a method of replacing a defective PCB of the array PCB, and a method of manufacturing an electronic device using the array PCB. Background technique [0002] The array PCB is formed of a plurality of single PCBs. When one or more of the plurality of single PCBs included in the array PCB is defective, the entire array PCB is discarded. Unfortunately, however, discarding the entire array PCB due to one or more defective PCBs in the array reduces the yield of the PCB manufacturing process. Accordingly, methods of reusing array PCBs including one or more defective single PCBs have been employed. For example, a defective single PCB may ...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/0268H05K1/0292H05K3/0052H05K3/0097H05K3/225H05K3/46
Inventor 金荣勋崔现硕李柱翰崔慧
Owner SAMSUNG ELECTRONICS CO LTD