A grinding method for high-precision hemispherical through-hole of beryllium material

Abstract

The invention relates to the technical field of high-precision grinding of special materials and especially relates to a grinding method of a beryllium semi-spherical part through hole of a dynamic-pressure motor. The invention puts forward practical and effective methods such as rational selection of a grinding material formula, and improvement of a grinding tool shape and materials, etc. In this way, the design drawing requirements that cylindrical degree precision of the semi-spherical through hole is less than 0.5 Mum and surface roughness Ra is 0.02 Mum are satisfied, and key problems of grinding and matching between the semi-spherical hole and a shaft are solved. It is proved in practice that the method satisfies requirements for design precision, has high efficiency, and is operated conveniently and now applied in actual work widely.

Description

technical field [0001] The invention relates to the technical field of high-precision grinding of special materials, in particular to a grinding method for a through hole of a beryllium dynamic pressure motor hemispherical part. Background technique [0002] In the hemispherical production of the hemispherical gyro dynamic pressure motor, the matching gap between the hemispherical hole and the shaft of the hemispherical gyro dynamic pressure motor is 1 μm-2 μm, and the error requirements are very strict. The stability and reliability of the gap between the hemispherical hole and the shaft is one of the elements to ensure the reliability of the dynamic pressure motor. If the gap is too large, the hemisphere is prone to micro-displacement during vibration, shock, centrifugal, temperature cycle and other tests and use, which affects the stability of its center of mass, and even causes problems such as the motor not starting and jamming. [0003] During the motor hemisphere tra...

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Problems solved by technology

[0006] 2) In the process of research and matching, although the grinding tool itself is constantly trimmed, due to wear, there will also be geometric changes, resulting in poor contact between the grinding tool and the inner hole of the hemisphere, and the degree of grinding is uneven

[0007] 3) The selected grinding tool and the hemispherical hole are not tightly matched, the two contact surfaces are not in full contact, and the gap is large, so that the hemispherical hole has a certain degree of freedom of radial movement relative to the grinding tool

As a result, during the research and matching work, it is difficult to manually ensure that the section of the hemispherical hole is always perpendicular to the axis of the grinding tool, forming an inclination, resulting in deflection, resulting in a large degree of grinding at the hole

[0008] During grinding and matching, if the gap between the grinding tool and the hemispherical hole is too small or the relative speed of the two is too fast, the grinding movement will be unstable, the friction force will be large, a lot of heat will be generated, the temperature will rise sharply, and the lubricating fluid will volatilize, seriously affecting the surface of the inner hole. Roughness and roundness

Since the grinding paste is not continuously supplied during grinding and compounding, it is easy to squeeze out the grinding paste and form dry friction. At this time, if the grinding tool itself has defects such as burrs and slight scratches, or the material of the grinding tool has high hardness, which is much larger than the hemispherical material, It is easy to scratch the surface of the inner hole

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