Image acquisition module used for improving assembling flatness, and assembling method thereof

Abstract

The invention relates to an image acquisition module used for improving assembling flatness, and an assembling method. The image acquisition module used for improving assembling flatness comprises an image sensing unit, a framework housing, an actuator structure and a reflecting material. The image sensing unit comprises a bearing substrate and an image sensing chip, wherein the top of the image sensing chip is provided with a first horizontal upper surface. The framework housing is arranged on the bearing substrate, and encircles the image sensing chip. The actuator structure comprises a lens holder arranged on the framework housing, and a movable lens module movably arranged in the lens holder. The reflecting material can be movably and temporary placed on the movable lens module, and the top of the reflecting material is provided with a second horizontal upper surface. The first horizontal upper surface of the image sensing chip and the second horizontal upper surface of the reflecting material are parallel in order to improve the assembling flatness of the movable lens module relative to the image sensing chip.

Description

technical field [0001] The present invention relates to an image capture module and its assembly method, especially to an image capture module and its assembly method for increasing the flatness of assembly. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Faced with the dual requirements of higher image quality and miniaturization. For the improvement of the picture quality of the imaging module, on the one hand, it is to increase the pixels. The market trend has been improved from the original VGA level of 30 pixels to the current common 2 million pixels, 3 million pixels, and even worse. Introduce a higher level of more than 8 million pixels. In addition to the improvement of pixels, another aspect is about the clarity...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention is to provide an image capture module and its assembly method for increasing the flatness of assembly, which can effectively solve the problem of "when the image sensor and bracket in the known image capture module use the circuit board as the stack reference plane When it is stacked sequentially, it will cause the assembly angle of the bracket relative to the image sensor to be too large, resulting in the lack of effective improvement of the image quality captured by the known imaging module.

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