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Chip electronic device and board for mounting chip electronic device

An electronic device and chip technology, which is applied in the direction of printed circuits, inductors, electrical components, etc. connected to non-printed electrical components, can solve the problem of large deviation of coil pattern thickness

Active Publication Date: 2017-11-14
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, since the electroplating method is performed at a relatively high current density, the shortage of supply of copper (Cu) ions depending on the velocity causes the formation of burning deposits on the distal ends of the coil patterns, and in addition, the thickness deviation between the coil patterns is large, So there is a need for a way to solve these problems

Method used

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  • Chip electronic device and board for mounting chip electronic device
  • Chip electronic device and board for mounting chip electronic device
  • Chip electronic device and board for mounting chip electronic device

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Experimental program
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Embodiment approach

[0078] According to an exemplary embodiment of the present invention, the coil conductor pattern may contain one or more materials selected from the group consisting of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti ), gold (Au), copper (Cu) and platinum (Pt), but not limited thereto.

[0079] Here, a manufacturing process of a chip type electronic device according to an exemplary embodiment of the present invention will be described.

[0080] First, the coil conductor pattern 42 and the coil conductor pattern 44 may be formed on the insulating substrate 23 .

[0081] The coil conductor pattern 42 and the coil conductor pattern 44 can be formed on the thin insulating base 23 by plating or the like. In this case, the insulating base 23 is not particularly limited. For example, a PCB, a ferrite substrate, a metal-based soft magnetic substrate, etc. may be used, and the thickness of the insulating substrate 23 may be 40 to 100 μm.

[0082] For example, a...

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Abstract

The present invention provides a chip electronic component which includes a magnetic body which includes an insulation substrate and a coil conductive pattern which is formed on at least one side of the insulation substrate and an external electrode which is formed on both ends of the magnetic body to be connected to the end of the coil conductive pattern. The coil conductive pattern includes a pattern plating layer, an electroplating layer which is formed on the pattern plating layer, and an anisotropic plating layer which is formed on the electroplating layer. In the cross section of the length-thickness direction of the magnetic body, the length of the lower side of the electroplating layer near the insulation substrate is longer than the length of the upper side of the electroplating layer.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2014-0066924 filed with the Korean Intellectual Property Office on Jun. 2, 2014, the contents of which are hereby incorporated by reference. Background technique [0003] The present invention relates to chip electronic devices and boards for mounting chip electronic devices. [0004] As chip electronic devices, inductors are typical passive components that together with resistors and capacitors form electronic circuits to eliminate noise. Inductors and capacitors are combined using electromagnetic properties to constitute resonance circuits, filter circuits, etc. that amplify signals in specific frequency bands. [0005] Recently, with the acceleration of miniaturization and thinning of information technology (IT) equipment such as various communication equipment, display equipment, etc., various components such as inductors, capacitors, transistors...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/28H01F27/30H05K1/18
CPCH01F17/0013H01F27/28H05K1/18
Inventor 郑汀爀房惠民金珆暎车慧娫
Owner SAMSUNG ELECTRO MECHANICS CO LTD