Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer transmission device and technology chamber

A transmission device and wafer technology, applied in the field of process chambers, can solve the problems of wafer or tray placement offset, low positioning accuracy, wafer or tray cannot meet the processing technology, etc., to achieve lower accuracy requirements and strong practicability Effect

Active Publication Date: 2016-01-06
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In general, the accuracy of the wafer or tray is guaranteed by the precision of the manipulator, but when the wafer or tray deviates on the manipulator during the transfer process, it is very easy to cause the wafer or tray to also deviate after being

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer transmission device and technology chamber
  • Wafer transmission device and technology chamber
  • Wafer transmission device and technology chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to solve the problem of low positioning accuracy of wafers or trays, a wafer transfer device capable of precisely positioning wafers or trays is proposed.

[0023] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0024] see figure 1 As shown, it is an overall schematic diagram of an embodiment of the wafer transfer device of the present invention. The wafer transfer device 100 includes a chuck mechanism and a jaw mechanism, wherein the chuck mechanism includes a chuck 110 and a chuck lifting mechanism 130, and the jaw mechanism includes a jaw lifting mechanism 140 and at least two movable jaws arranged oppositely. 120; see image 3 , the movable claw 120 includes a boss 121, a rot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wafer transmission device. The wafer transmission device comprises a chuck mechanism and a claw mechanism, wherein the chuck mechanism comprises a chuck and a chuck elevating system, the claw mechanism comprises a claw elevating mechanism and at least two movable claws which are oppositely arranged, the movable claws comprise bosses, rotation shafts and swinging members, the bosses are fixed on the claw elevating mechanism, the swinging members are fixed on the bosses through the rotation shafts and can swing in a mode of taking the rotation shafts as centers, and the chuck can drive the swinging members to swing. The invention further provides a technology chamber including the wafer transmission device. Through the wafer transmission device, a wafer or a tray on the chuck can be precisely positioned.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a wafer transfer device for transferring wafers and a process chamber comprising the wafer transfer device. Background technique [0002] In the prior art, in the semiconductor processing technology, it is necessary to transfer the wafer or the tray to each reaction chamber through the manipulator, and the manipulator places the wafer in the reaction chamber, and then takes the wafer or the tray out of the reaction chamber after processing , Process engineering has high requirements on the accuracy of wafer or tray pick-and-place. The pick-and-place process is usually achieved through the cooperation of the manipulator and the thimble or jaws located in the chamber. The accuracy of the transmission depends on the pick-and-place accuracy of the manipulator and the positioning accuracy of the thimble or jaws. [0003] In general, the accuracy of the wafer or tray is guarant...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/677H01L21/68
Inventor 叶华郭浩
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD