Sprinkler unit with electrodes

Abstract

The invention discloses a spray head device with electrodes. The spray head device comprises an insulation base, the external electrode, an external insulation cover, the internal electrode, an internal insulation cover, a liquid drainage tank and an insulation flow guide pipe. The insulation base is provided with an insulation base body. The external electrode is fixed to and covers the inner side wall and the top wall of the insulation base body. The external insulation cover comprises an insulation tube and an insulation cover body, and the outer sided wall of the top end of the insulation tube extends outwards to form the insulation cover body. The insulation tube is contained in a containing cavity of the external electrode and stretches out of the containing cavity. The insulation cover body is located above the external electrode fixed to the top wall of the insulation base body. A channel defined by the inner side wall of the insulation tube is defined as a main fluid channel. The outer side wall of the insulation tube and the inner side wall of the external electrode are spaced by a certain distance to form an auxiliary fluid channel. The internal electrode is arranged in the insulation tube of the external insulation cover. The internal insulation cover is arranged on the periphery of the internal electrode in a covering manner, and the top end of the internal insulation cover is lower than the top end of the insulation tube of the external insulation cover. Polishing liquid is collected by the liquid drainage tank.

Description

technical field [0001] The invention relates to the technical field of electrochemical polishing, in particular to a shower head device with electrodes. Background technique [0002] Electrochemical polishing is a stress-free polishing technology. During the electrochemical polishing process, a conductive polishing liquid is required, and the polishing liquid is sprayed onto the wafer surface through a nozzle. The nozzle suitable for electrochemical polishing has an electrode, which is electrically connected to the cathode of the power supply to charge the polishing liquid. The nozzle cooperates with the fixture electrically connected to the anode of the power supply to accurately perform electrochemical polishing on a specific area of ​​the wafer surface craft. The removal rate of the electrochemical polishing process is related to the current density and polishing process time of the area corresponding to the wafer surface and the nozzle. Therefore, the electrochemical po...

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Problems solved by technology

[0004] When increasing the pipe diameter of the tube body 131 of the above-mentioned insulating cover 13 in order to improve the polishing efficiency, the removal rate of the center of the area corresponding to the mouth of the tube body 131 on the wafer surface is low, thereby causing the wafer surface to be polished. The uniformity of removal rate reduces, traces it to its cause, mainly because the current density distribution of the polishing liquid in the main fluid channel 133 is not uniform, and the current density of the polishing liquid near the inner wall of the pipe body 131 is greater than that of the polishing liquid at the center of the pipe body 131. current density

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