Vacuum suction cup
A technology of vacuum suction cups and suction cups, which is applied in the direction of suction cups, electrical components, connecting components, etc., can solve the problems of high cost, inability to use, and limited position, and achieve the effects of low cost, uniform flow rate, and smooth flow
Active Publication Date: 2018-01-12
RAINTREE SCI INSTR SHANGHAI
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Problems solved by technology
However, although the vacuum chuck can achieve the adsorption of silicon wafers of different sizes, this technical solution requires multi-channel control to ensure good bonding, and the cost is relatively high
In addition, the suction cups disclosed in Chinese patents with application numbers 201120335585.4 and 201210230374.3 are similar to the suction cups disclosed in Chinese patent 201120335585.4, but the side air intake mode has been changed to the bottom air intake mode, and the bottom air intake mode has limited position and cannot problem of use
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[0026] As required, specific embodiments of the invention will be disclosed herein. However, it should be understood that the embodiments disclosed herein are merely typical examples of the invention, which can be embodied in various forms. Therefore, specific details disclosed herein are not to be considered limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the invention in any appropriate way in practice, This includes taking various features disclosed herein and combining features that may not be expressly disclosed herein.
[0027] The vacuum chuck 100 according to the preferred embodiment of the present invention is as Figure 1 to Figure 3 As shown, it is suitable for adsorbing silicon wafers on its adsorption surface, including a suction cup body 1, and the upper surface 10 of the suction cup body 1 constitutes the adsorption surface. The inside of the suction cup body 1 has a radial ai...
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A vacuum suction cup, including a suction cup body and a gas channel, the gas channel includes at least two groups of concentric circular grooves on the adsorption surface and at least two radial air channels inside the suction cup body, each group of concentric circular grooves has at least two concentric Circular grooves, an isolation zone is provided between every two groups of adjacent concentric circular grooves, and at least one radial groove is provided between each group of concentric circular grooves at the position corresponding to the radial air passage so that the group of concentric circular grooves Communicate with each other, at least one vertical air hole is provided between the radial air channel and the radial groove so that the radial air channel communicates with the concentric circular groove, at least two radial air channels communicate with each other at the inner end, and one at the outer end Connecting the other vacuum joint is suitable for receiving a sealing plug corresponding to the specification of the adsorbed silicon wafer, so as to control the at least one set of radially outward concentric air grooves and the vacuum joint by controlling the blockage of the radially outward vertical air holes. Connected to realize the adsorption of different silicon wafers. The structure of the invention is simple to process and has good adsorption effect on silicon wafers.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a vacuum chuck used for fixing silicon wafers in semiconductor manufacturing process equipment. Background technique [0002] In semiconductor manufacturing process equipment, silicon wafers need to be fixed on a support platform during process production and testing processes. The commonly used silicon chip fixing methods are basically adsorption, including vacuum adsorption and electrostatic adsorption. The vacuum adsorption method is to generate a vacuum in the contact area between the silicon chip and the surface of the suction cup, and rely on the pressure generated by the pressure difference between the two sides of the silicon chip to move the silicon The sheet is firmly fixed on the vacuum suction cup. [0003] Vacuum chucks commonly used in the industry have the following two applications according to the size of the silicon wafers that can be adsorbed: the us...
Claims
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IPC IPC(8): H01L21/683F16B47/00
Inventor 屈俊健周广梅
Owner RAINTREE SCI INSTR SHANGHAI