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Slurry supply device and polishing apparatus including the slurry supply device

A technology for supplying devices and abrasive fluids, which is applied in the direction of grinding/polishing equipment, grinding devices, abrasive surface adjustment devices, etc., and can solve problems such as damage, contamination of objects to be polished, and adhesion of abrasive fluids

Active Publication Date: 2017-11-24
LG SILTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of a conventional slurry supply device, when the slurry is supplied from a nozzle (not shown) to a slurry ring (not shown), contaminants such as dust, metal, etc. may adhere to the slurry, thereby , causing the slurry to stick to the inner slurry tube of the upper plate, or causing contamination or damage to the object to be polished

Method used

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  • Slurry supply device and polishing apparatus including the slurry supply device
  • Slurry supply device and polishing apparatus including the slurry supply device
  • Slurry supply device and polishing apparatus including the slurry supply device

Examples

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Embodiment Construction

[0039] Hereinafter, various embodiments will be described in detail in the best manner with reference to the accompanying drawings in order to improve the understanding of these embodiments. However, various modifications of these embodiments are possible, and the technical spirit of these embodiments is not construed as limiting these embodiments. The various embodiments of the present disclosure are provided to explain the present disclosure to those skilled in the art.

[0040] Hereinafter, a slurry supply device according to various embodiments will be described with reference to the accompanying drawings.

[0041] figure 1 is a plan view showing a polishing liquid supply device 100 according to an embodiment, Figure 2A is shown without the grinding fluid protection unit 140, figure 1 A plan view of the shown grinding liquid supply device 100, Figure 2B is shown figure 1 A plan view of an embodiment 140A of the slurry protection unit 140 of the slurry supply device ...

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PUM

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Abstract

Disclosed is a grinding liquid supply device, comprising: a nozzle configured to spray a grinding liquid; a grinding liquid supply unit configured to receive the grinding liquid from the nozzle and discharge the grinding liquid through at least one grinding liquid hole; a receiving unit configured to allowing the slurry supply unit to be mounted, inserted, seated, coupled, supported or placed therein to enable discharge of slurry from the slurry supply unit, the receiving unit being configured to receive flowing material around the slurry supply unit; and the slurry The protection unit is configured to enclose a space for the abrasive liquid to pass from the outlet of the nozzle to the inlet of the abrasive liquid supply unit together with the flowing material.

Description

technical field [0001] Various embodiments relate to a slurry supply device and a polishing apparatus including the slurry supply device. Background technique [0002] Due to higher integration of semiconductor devices, it has been recognized that scratches or defects of semiconductor wafers caused by grinding or chemical-mechanical double-side polishing (DSP) have a significant impact on the yield and productivity of semiconductor devices in each wafer production process. important factor of great influence. Specifically, in the current process of producing semiconductor devices using large-diameter wafers (for example, wafers with a diameter of 300 mm), the size and precision of wafers, grinding plates, polishing heads, polishing pads, and the like increase. [0003] Use the slurry for regular grinding or double-sided polishing. In the case of a conventional slurry supply device, when the slurry is supplied from a nozzle (not shown) to a slurry ring (not shown), contamin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B57/02
CPCB24B57/02B24B37/04H01L21/304B24B53/017
Inventor 裴栽贤韩基润
Owner LG SILTRON