A method for maintaining the balance of the grinding rate of the grinding machine
A grinding machine platform and grinding rate technology, which is applied in the direction of grinding machine tools, grinding devices, metal processing equipment, etc., can solve the problems of scrapped production pieces, achieve the effect of grinding rate balance and make up for losses
Active Publication Date: 2017-11-03
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
At present, we will use the continuous Pirun of the product to the machine to correct the change of the grinding rate, so that the production capacity will be sacrificed, and the quality of some produced wafers will also be sacrificed. At the same time, the risk of scrapping the Pirun produced wafers will also increase, so it is necessary to make the grinding during the CMP grinding process The rate tends to be stable in order to ensure the stability of the thickness of the silicon wafer after grinding so as to ensure the product quality
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[0036] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0038] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0039] Such as figure 1 As shown, the method for maintaining the grinding rate balance of the grinding machine...
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The invention relates to the field of chemical mechanical grinding, in particular to a method for maintaining balance of the grinding rate of a grinding machine table. The grinding machine table comprises a grinding disc, a grinding pad, a grinding head and a grinding pad dresser. The method comprises the steps that a semiconductor device to be ground is provided, the semiconductor device is placed on the grinding machine table, and the chemical mechanical grinding technique is conducted on the semiconductor device. The pressurization function of the grinding head is adopted, and the loss of the grinding rate due to the change of the service life of the grinding pad and the grinding pad dresser is made up by adjusting the pressure on the grinding disc by the grinding head, and thus the balance of the grinding rate is maintained.
Description
technical field [0001] The invention relates to the field of chemical mechanical grinding, in particular to a method for maintaining the grinding rate balance of grinding machines. Background technique [0002] In the chemical mechanical polishing (CMP) process, as the life of the polishing pad and the polishing pad dresser increases, the groove on the surface of the polishing pad gradually becomes shallower, and the sharpness of the diamond wheel on the polishing pad dresser also gradually decreases. The grinding rate of the silicon wafer will also gradually decrease (such as figure 2 The trend line of grinding rate versus disc life is shown, and image 3 The trend line of the grinding rate shown in the polishing pad life), so the grinding rate will also show periodic changes with the PM cycle (such as figure 1 shown). However, with the improvement of chip integration, the line width becomes narrower, and the window of silicon wafer thickness after grinding is also gett...
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IPC IPC(8): B24B37/00B24B1/00
CPCB24B1/00B24B37/00
Inventor 吴科文静张传民
Owner SHANGHAI HUALI MICROELECTRONICS CORP