a glue dispenser
A technology of dispensing machine and rack, applied in the field of machinery, can solve the problems of wasting labor, flying out, danger and so on
Active Publication Date: 2018-02-23
苏州高新区华成电子有限公司
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Problems solved by technology
[0004] In the prior art, the invention patent with the application number "201320267091.6" discloses a glue dispenser for diodes, which prevents it from being polluted by the outside by dispensing glue on the PN junction on the diode, but this kind of glue dispensing During the production process of the machine, the diodes are transported by using a fixed plate loaded with diodes, but the operator must collect the fixed plate at the other end of the dispenser, which is a waste of labor. At the same time, if the operator does not block the dispensing The track groove of the machine, the diode fixing plate will fly out directly, which is very dangerous
Method used
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Embodiment Construction
[0025] refer to Figure 1 to Figure 7 Embodiments of the present invention will be further described.
[0026] like figure 1 and image 3 As shown, a dispensing machine O receiving mechanism includes a frame 1, and the frame 1 includes a receiving tray 12, a feed port 11, a board arrangement device 14 and a detection device 13, and the receiving tray 12 is arranged on the frame 1 Above, the receiving tray 12 can be used to accommodate the diode fixing plate 02; the feed inlet 11 is respectively arranged at the corresponding positions of the frame 1 and the receiving tray 12, and the receiving tray 12 is provided with a handle for lifting in the present invention, and at the same time The feeding port 11 is arranged on the side of the receiving tray 12, and the feeding port 11 is set through the entire receiving tray 12, and the receiving tray 12 is used to receive the diode fixing plate 02 from the material path of the dispenser 0; the plate arrangement device 14, which is ...
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The invention discloses a glue dispensing machine material receiving mechanism and a glue dispensing machine. The key point of the technical scheme is a glue dispensing machine material receiving mechanism, which includes a frame, and the frame includes a material receiving tray, a feeding port, and a row plate. Device and detection device: receiving tray, the receiving tray is arranged on the frame, which is used to accommodate the diode fixing plate; the feeding port, which is respectively arranged at the corresponding position of the frame and the receiving tray, is used to receive the The diode fixing plate on the material path of the glue dispenser; the plate arrangement device, which is arranged on the frame, is used to make the diode fixing plate enter the receiving tray in sequence; the detection device is used to detect the diode fixing plate entering the receiving tray. The number of boards controls the dispensing machine to stop. By being provided with a board arranging device, the board arranging device sequentially sends the diode fixing boards into the receiving tray, so that the diode fixing boards can enter the receiving tray from the feeding port in order to complete automatic receiving.
Description
technical field [0001] The invention relates to the field of machinery, more specifically, it relates to a material receiving mechanism of a glue dispenser and a glue dispenser. Background technique [0002] With the continuous development of science and technology, the electrical equipment used by people has risen. In the field of electrical appliances, semiconductors are a common electrical component. It plays an important role in many circuits. For example, in the metallurgical industry, chemical production , Power engineering, paper industry. [0003] Diode is a kind of semiconductor material, its core is PN junction, which has the characteristics of forward conduction, reverse cut-off, breakdown, good shock resistance, low power consumption, and low cost. [0004] In the prior art, the invention patent with the application number "201320267091.6" discloses a glue dispenser for diodes, which prevents it from being polluted by the outside by dispensing glue on the PN jun...
Claims
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IPC IPC(8): B05C13/02
Inventor 叶惠东
Owner 苏州高新区华成电子有限公司