Epoxy molding compound for encapsulating semiconductor element

An epoxy molding compound and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc. Production efficiency and other issues, to achieve the effect of excellent fluidity and resistance to solder cracking, excellent formability and resistance to solder reflow

Active Publication Date: 2016-03-23
WUXI CHUANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above method can significantly improve the solder resistance of epoxy molding compound and reduce cracking, but the problem is that as the amount of inorganic filler increases, the fluidity becomes shorter, which leads to easy generation of pores and defects in the packaging process. At the same time, the epoxy mold The production of plastics has also become difficult, prone to dead material, seriously affecting production efficiency
Therefore, it is impossible to achieve high fluidity, high solder resistance, and crack resistance at the same time only by using these methods.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1 includes the following components:

[0036] E-1: 6.0 parts by weight

[0037] P-1: 5.1 parts by weight

[0038] W-1: 4.5 parts by weight

[0039] Spherical silicon powder: 83.0 parts by weight

[0040] 2-Methylimidazole: 0.2 parts by weight

[0041] Zinc borate: 0.4 parts by weight

[0042] Silane coupling agent: 0.3 parts by weight

[0043] Wax release agent: 0.2 parts by weight

[0044] Carbon black: 0.3 parts by weight

[0045] The above materials are uniformly mixed in a high-mixer at room temperature, and then melted and mixed at 80-100° C. through a twin-screw extruder, cooled, and then pulverized to obtain an epoxy molding compound after mixing. The epoxy molding compound was evaluated according to the following methods. The evaluation results are shown in Table 1.

[0046] Spiral flow length: Test with EMMI-1-66 spiral flow metal mold on a transfer molding machine. The test conditions are: temperature: 175°C, pressure: 7.0MPa, and pressure holding time: 120s. The s...

Embodiment 2-10 and comparative Embodiment 11-13

[0049] Examples 2-10 and Comparative Examples 11-13 were prepared according to the components and contents included in Table 1, using the same method as that of Preparation Example 1 to prepare epoxy molding compounds, and the same evaluation method as Example 1 was used. Make an evaluation. The results are shown in Table 1.

[0050] Table 1

[0051]

[0052] The epoxy molding compound used for encapsulating semiconductor components of the present invention has excellent properties such as ensuring high filling, high fluidity, low stress, and good solder reflow resistance. When the epoxy molding compound is used for semiconductor element packaging, the moldability is excellent, and the adhesion to the lead frame is also excellent, and a semiconductor device with excellent solder reflow resistance can be obtained. Therefore, the epoxy molding compound can be advantageously used for semiconductor element packaging.

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PUM

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Abstract

The invention discloses an epoxy molding compound for encapsulating a semiconductor element. The epoxy molding compound is prepared from the following components in percentage by weight: 4.7 to 7.7 percent of epoxy resin, 3.9 to 6.9 percent of phenol-formaldehyde resin, 0.1 to 0.5 percent of curing accelerator, 80.0 to 86.0 percent of inorganic fillers and 0.1 to 10 percent of porous micro spheres, wherein the d50 particle diameter of the porous micro spheres is 1 to 20 mum, the pore diameter of a pore channel of the porous micro spheres is 10 to 800 nm, and the BET specific surface area of the porous micro spheres is 300 to 1000 m<2> / g. The epoxy molding compound disclosed by the invention has the advantages that the epoxy molding compound obtained through the invention is used as an encapsulating material, the epoxy molding compound has the characteristics of excellent fluidity and excellent weld cracking resistance when being applied to production of semiconductor devices, and the obtained semiconductor devices have the advantages of excellent formability and excellent weld reflowing resistance.

Description

Technical field [0001] The invention relates to the field of epoxy molding compounds, in particular to an epoxy molding compound for packaging semiconductor elements. Background technique [0002] In the recent market trends of miniaturization, weight reduction, and high performance of electronic equipment, the high integration of semiconductor elements has been continuously developed. In addition, in the promotion of surface mounting of semiconductor devices, the use of epoxy molding compounds for semiconductor packaging has been promoted. The requirements are getting stricter. With the miniaturization and thinning of semiconductor devices, the requirements for epoxy resin compositions for semiconductor sealing have become increasingly strict. The miniaturization, light weight, and integration of semiconductor devices require epoxy molding compound to have higher fluidity, otherwise it is easy to produce pores and defects during the packaging process; when semiconductor devices...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08K13/04C08K7/26C08K7/24C08K3/36C08K3/22C08K3/04C08K3/38C08K5/3445H01L23/29
CPCC08L63/00C08L61/06C08L2205/02C08L2205/03H01L23/295C08K13/04C08K7/26C08K3/36C08K3/04C08K2003/387C08K5/3445C08K7/24C08K2003/2227
Inventor刘娜
OwnerWUXI CHUANGDA ELECTRONICS