A macro-channel liquid refrigerator and combination thereof

Abstract

The invention proposes a macro-channel liquid refrigerator and a refrigerator combination. According to the macro-channel liquid refrigerator, a water inlet and a water outlet parallel to each other are formed in the side surfaces of the liquid refrigerator in a run-through manner; a liquid cooling loop of a macro-channel is arranged in the liquid refrigerator; multiple layers of spaced circulating waterways are formed in the liquid refrigerator; and water in the circulating waterways flows through a region between a refrigerating working surface and the water inlet of the liquid refrigerator from the water inlet, and then flows back to the water outlet. The liquid refrigerator is good in structural property, high in rigidity, unlikely to deform and suitable for subsequent assembly; and the unique multi-layer parallel circulating waterway structure remarkably improves the heat dissipation effect.

Description

technical field [0001] The invention relates to a macro-channel liquid refrigerator. Background technique [0002] The heat dissipation design of high-power semiconductor lasers is one of the core contents of packaging. Current high-power semiconductor lasers are usually packaged in the following ways: [0003] a) if figure 1 , figure 2 As shown, the laser bar is directly bonded to a liquid cooler using a microchannel-based structural heat sink. This kind of packaging structure can achieve higher power output through the superposition of heat sinks, but this packaging method has the following disadvantages: first, the microchannel is easy to be blocked because of the narrow water channel; second, the heat sink itself is charged, so it must be Deionized water is used for cooling, and there are high requirements for ion concentration; third, the high-speed water flow in the micro-channel will cause erosion of the channel and lead to product failure; fourth, the overall st...

AI Technical Summary

Problems solved by technology

This kind of packaging structure can achieve higher power output through the superposition of heat sinks, but this packaging method has the following disadvantages: first, the microchannel is easy to be blocked because of the narrow water channel; second, the heat sink itself is charged, so it must be Deionized water is used for cooling, and there are high requirements for ion concentration; third, the high-speed water flow in the micro-channel will cause erosion of the channel and lead to product failure; fourth, the overall strength and stiffness of the micro-channel heat sink are lacking , easy to bend and deform during assembly and manufacturing, thus affecting the quality of the package

Based on each product of this heat sink structure, it is difficult to assemble and splice to achieve the expansion of the number of bars

When more bars are needed, only bottom heat sinks of different sizes can be made for matching and adaptation

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