Technological cavity and method for judging whether position of wafer on tray is abnormal or not

Abstract

The invention provides a technological cavity and a method for judging whether the position of a wafer on a tray is abnormal or not. The technological cavity comprises the tray, a drive unit, and a detection unit, wherein the drive unit is used for driving the tray to rotate. The detection unit is disposed to be at a first preset detection point above the tray, and is used for detecting the vertical distances from the first detection point to all intersection points on the surface of the tray when the wafer carried by the tray rotates through rotating angles corresponding to all intersection points. Whether the vertical distance corresponding to each intersection point exceeds a preset distance threshold value or not is judged. A part, located at a side of the intersection point, of the wafer placed in an installation groove corresponding to the intersection extends out from the edge of the installation groove in an inclined manner if the vertical distance corresponding to the intersection point exceeds the preset distance threshold value. The technological cavity provided by the invention not only can directly judge which edge of the wafer placed in the installation groove is overlapped and which installation groove the edge-overlapped wafer is located in, but also can judge whether an overlapping phenomenon happens in a process that a mechanical arm places the wafer or not.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a process chamber and a method for judging whether the position of a wafer on a tray is abnormal. Background technique [0002] In the manufacturing process of semiconductor devices, the wafer is generally placed in a sealed and clean container or cassette, and the robot is used to automatically pick and place wafers between the container or cassette and the process chamber to prevent foreign particles from affecting the wafer. Wafer contamination. For example, in chemical vapor deposition (Chemical VaporDeposition, CVD) equipment, it generally uses trays to carry wafers in the process chamber. , used to define the position of the wafer. In addition, the tray is connected with the rotary motor and rotates under the drive of the rotary motor. When performing the pick-and-place operation of the manipulator, firstly, driven by the motor, the tray rotates at a cer...

AI Technical Summary

Problems solved by technology

However, this method not only cannot determine which wafer in the slot in the tray overlaps, but also cannot know whether the above-mentioned "overlapping" phenomenon occurs during the process of placing the wafer by the manipulator.

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