Resin encapsulation method and resin encapsulation device

Abstract

The invention provides a resin sealing method and a resin sealing apparatus, and solves poor conditions in the resin sealing molding process, which are caused by the thickness deviation of the substrates supplied to a resin sealing die. A substrate is prepared, the substrate is provided with the size (width) capable of covering a resin supplying part of a lower die, two resin channel parts, two resin molding parts and a parting surface, formed on the periphery of the resin molding part, of the lower die. By enabling two groups of sealed parts mounted on the substrate to face downwards, the substrate is arranged on a substrate accommodating part of an upper die. In the engaging process of the upper die and the lower die, the two groups of sealed parts on the substrate are respectively accommodated in the two resin molding parts of the lower die. The state after die engagement is maintained, and flowing resin is solidified in each resin molding part, so that the sealed parts in each resin molding part are sealed in the resin sealing member formed by the solidified resin.

Description

technical field [0001] The present invention relates to a resin encapsulating method and a resin encapsulating device for resin encapsulating components to be encapsulated such as electronic components mounted on a substrate. More specifically, it relates to a resin encapsulation method and a resin encapsulation device which are improved to effectively prevent defects such as molding defects due to differences in thickness of substrates supplied to a resin encapsulation mold. Background technique [0002] A resin sealing method and a resin sealing device for realizing high-efficiency production are known by supplying two substrates to a resin molding mold and simultaneously resin-sealing components to be packaged on the respective substrates. [0003] For example, if Figure 5 As schematically shown in , the resin encapsulation mold 1 installed in the resin encapsulation device is composed of an upper mold 1a and a lower mold 1b arranged up and down opposite to each other. ...

AI Technical Summary

Problems solved by technology

[0020] However, in the technical solution described in Patent Document 1, the thicknesses of the two substrates supplied and placed on the upper mold must be the same

[0021] Therefore, when the thicknesses of the two substrates are different from each other, there is a problem that effective resin encapsulation cannot be expected.

[0022] Furthermore, when the thicknesses of the two substrates are different from each other, it is necessary to adopt a mold clamping pressure adjustment mechanism (floating mold structure, etc.) Upscaling and upsizing, and the overall manufacturing cost of the resin potting mold and the resin potting device is high

Images