A 3D printing device for semiconductor deep cooling and heating

Abstract

The invention discloses a 3D printing apparatus with deep refrigeration and heating by a semiconductor, wherein the 3D printing apparatus can provide cold air and hot air during additive 3D printing. The 3D printing apparatus is provided with: a refrigeration air blowing terminal and a heating air blowing terminal. In the refrigeration air blowing terminal, a semi-sealed temperature insulation chamber is formed by a cold air blowing fan and a cold insulation cover shell and is connected to a cold conductive air duct. Cold air is generated on a metal cold grid on the refrigeration terminal in an electronic semiconductor refrigerating piece and then is extruded into the cold conductive air duct in which cold-conductive metal wires are arranged everywhere to achieve deep refrigeration, thereby increasing metal contact area of cold-heat conduction, furthermore greatly reducing the temperature of cold air at an air outlet and achieving better refrigeration effect. The heating air blowing terminal has the same structure as the refrigeration air blowing terminal, so that hot air is supplied to some processes, such as hot air polishing, for the 3D printer.

Description

technical field [0001] The present invention relates to the field of 3D printing technology, and more specifically, relates to a 3D printer processing device using electronic semiconductors for heating and cooling. Background technique [0002] The current 3D printers do not have a hot air supply device during additive manufacturing, so they cannot implement some processes such as hot air grinding. Moreover, after the 3D printer extrudes the hot-melt material or laser sintering material, it generally does not install a cooling device on the material, or simply uses a fan to blow the target object, because the heat in the 3D printer box itself is relatively high, especially for FDM additive models. , causing the printed target item to cool down for a long time, so that before the target item is completely cooled, it is easy to deform and dimensional deviation due to the fluid characteristics of the high-temperature material, resulting in the target item not reaching the set p...

AI Technical Summary

Problems solved by technology

Use the cold air generated by the cooling end of the electronic semiconductor cooling sheet, and pass through the cold-conducting air duct covered with cold-conducting metal wires to increase the contact area of ​​cold and heat conduction, resulting in better cooling effect, and quickly process the hot-melt material extruded by the print head. Cold solidification, which solves the problems of deformation and size deviation due to the fluid characteristics of high-temperature materials when 3D printers are printing additive materials, and the target items cannot reach the set precise size.

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