Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and system for detecting film errors

A film and error technology, which is applied in the field of real-time detection of film errors, can solve the problems that affect the judgment results, cannot immediately interpret the errors of glass fiber substrates, film deformation, etc.

Inactive Publication Date: 2018-09-21
C SUN MFG
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the negative film and the glass fiber substrate cannot be aligned successfully, it is impossible to immediately judge the error of the negative film or the glass fiber substrate, resulting in alignment problems
At present, the negative film is usually disassembled and sent back to the negative film room for size confirmation. After confirming that the size of the negative film is deformed, the negative film will be replaced. deformation, which further affects the result of judgment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for detecting film errors
  • Method and system for detecting film errors
  • Method and system for detecting film errors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] refer to figure 1 , an embodiment of the system for detecting film errors of the present invention is suitable for detecting the error value of a film 31 to be exposed. Wherein, the negative film 31 includes a line area 311 having a predetermined line pattern 300 , an invalid area 312 surrounding the line area 311 , and at least four alignment symbols 313 outside the line area 311 .

[0029] An embodiment of the system includes an exposure device 2 and a detection unit 20 .

[0030] The exposure device 2 is an automatic exposure machine currently used in the industry to manufacture semiconductor integrated circuits, figure 1 The exposure device 2 shown is a schematic diagram of an automatic exposure machine, and the main components related to the present invention are disclosed for illustration. The exposure device 2 includes an alignment pl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for detecting negative film error includes: a supplement step, in which a light transmitting substrate which is arranged on an exposure apparatus and is provided with at least four positioning markers, and a negative film which is provided with at least four alignment markers which are corresponding to the positioning markers; an arrangement step, in which the negative film is arranged on the light transmitting substrate; and a detection step, in which the deviation from the positioning markers to the alignment markers is measured to obtain error value of the negative film. The invention also provides a system executing the method.

Description

technical field [0001] The invention relates to a method and system for detecting film errors, in particular to a method and system for detecting film errors in real time for an exposure device. Background technique [0002] The current circuit pattern formation method on the printed circuit board is mainly to form a pre-designed circuit pattern on a light-permeable film, and then develop the circuit on the film on a glass fiber substrate by exposure and development technology. pattern, and then carry out subsequent processing to make the printed circuit board. Wherein, before performing the exposure and developing step, the alignment target of the film must be used to accurately align with the alignment hole of the glass fiber substrate, so that the circuit pattern on the film can be accurately formed on the predetermined position of the substrate. [0003] Generally speaking, the circuit pattern on the negative film is firstly designed in the negative film room, and then ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F9/00
Inventor 徐嘉伟王啓毓
Owner C SUN MFG