Method and device for controlling operation in multi-chip package based on temperature deviation

Abstract

Provided is a multi-chip package, the temperature sensor includes a first die and a second die to the first die by a temperature the sensors generate n bits of temperature information to generate m (m & < n) bits of temperature deviation information. a first die provides m-bit temperature deviation information, instead of n bits of temperature information to a second die of the second die internal operations used by the first die output information to control the temperature deviation.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2015-0049952 filed with the Korean Intellectual Property Office on Apr. 8, 2015, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The inventive concept relates to semiconductor devices. More specifically, the inventive concept relates to a semiconductor device, such as a DRAM, having temperature-dependent operating characteristics, and to a multi-chip semiconductor device package including a first die and a second die for use in accordance with ambient temperature to control the operation of the first die. Background technique [0004] In a dynamic random access memory (DRAM), data is written by storing charges in cell capacitors, ie, a write operation is performed. However, the charge stored in the capacitor of the DRAM dissipates over time without any read or write operation being performed d...

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Problems solved by technology

However, the charge stored in the capacitor of the DRAM is dissipated over time without any read or write operation being performed due to the leakage current of the cell capacitor

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