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Glue spraying technology of flexible circuit board

A technology of flexible circuit board and glue spraying, which is applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc. It can solve the problems of labor cost and low production efficiency, and achieve fast curing speed, good effect and good heat resistance performance effect

Active Publication Date: 2016-11-09
DONGGUAN MARCO AUTOMATION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The glue spraying process of the existing flexible circuit board is to cut the whole board of the flexible circuit board into strips of lights (dozens of strips after cutting), and then weld and splice them into several meters, and then put the welded lights Sticking one by one to the tooling for glue spraying, the production efficiency is low and labor-intensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A glue spraying process for flexible circuit boards includes the following steps:

[0057] (1) Whole board patch: multiple flexible circuit boards are individually patched to obtain multiple LED flexible light boards;

[0058] (2) Whole board welding: Weld the first and last LED soft light boards in order to obtain the whole LED soft light board;

[0059] (3) Glue spraying on the entire board: spray glue on the soldered LED soft light board.

[0060] In the step (3), the distance between the glue outlet and the LED soft light board is 0.4mm, the glue pressure is 0.12MPa, the glue speed is 10cm / s, and the glue thickness is 0.3 mm.

[0061] In the step (3), the glue used for spraying includes the following raw materials by weight:

[0062] Epoxy resin 15 parts

[0063] Phenolic resin 15 parts

[0064] Synthetic rubber 5 parts

[0065] Filler 5 parts

[0066] Flame retardant 1 part

[0067] Curing agent 1 part

[0068] Curing accelerator 0.5 parts

[0069] Coupling agent 0.5 parts

[0070] ...

Embodiment 2

[0079] The difference between this embodiment and the foregoing embodiment 1 is:

[0080] In the step (3), the distance between the glue outlet and the LED soft light board is 0.5mm, the glue pressure is 0.13MPa, the glue speed is 12cm / s, and the glue thickness is 0.35 mm.

[0081] In the step (3), the glue used for spraying includes the following raw materials by weight:

[0082] Epoxy resin 20 parts

[0083] Phenolic resin 20 parts

[0084] Synthetic rubber 8 parts

[0085] Filler 8 parts

[0086] Flame retardant 2 parts

[0087] Curing agent 2 parts

[0088] Curing accelerator 0.8 parts

[0089] Coupling agent 0.8 parts

[0090] 90 parts of solvent.

[0091] The epoxy resin is a high heat resistance epoxy resin.

[0092] The phenolic resin is a mixture composed of phenolic phenolic resin and bisphenol A phenolic resin in a weight ratio of 1:0.8; the synthetic rubber is a mixture of styrene butadiene rubber and nitrile rubber in a weight ratio of 1:1.8.

[0093] The filler is a mixture compos...

Embodiment 3

[0099] The difference between this embodiment and the foregoing embodiment 1 is:

[0100] In the step (3), the distance between the glue outlet and the LED soft light board is 0.6mm, the glue pressure is 0.14MPa, the glue speed is 15cm / s, and the glue thickness is 0.4 mm.

[0101] In the step (3), the glue used for spraying includes the following raw materials by weight:

[0102] Epoxy resin 25 parts

[0103] Phenolic resin 25 parts

[0104] Synthetic rubber 10 parts

[0105] Filler 10 parts

[0106] Flame retardant 3 parts

[0107] Curing agent 3 parts

[0108] Curing accelerator 1 part

[0109] Coupling agent 1 part

[0110] 100 parts of solvent.

[0111] The epoxy resin is a flame-retardant epoxy resin; the flame-retardant epoxy resin is a phosphorus-containing epoxy resin with a phosphorus content of 1% by weight.

[0112] The phenolic resin is a mixture composed of phenol-type phenolic resin and bisphenol A-type phenolic resin in a weight ratio of 1:1; the synthetic rubber is a mixture of...

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PUM

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Abstract

The invention relates to the electronic product technology field and especially relates to a glue spraying technology of a flexible circuit board. The technology comprises the following steps of (1) carrying out entire board paster: carrying out paster processing on a plurality of flexible circuit boards respectively so as to acquire a plurality of LED soft lamp plates; (2) carrying out entire board welding: successively welding heads and tails of the plurality of LED soft lamp plates so as to acquire an entire LED soft lamp plate; and (3) carrying out entire plate glue spraying: carrying out glue spraying processing on the welded LED soft lamp plates. In the invention, through adopting the entire board paster, the entire board welding and the entire plate glue spraying, an entire plate breadth of the LED soft lamp plates is wide so that glue spraying operation is easy to perform; and dozens of lamp bands can be sprayed at a time so that a glue spraying production capacity of the LED soft lamp plates is greatly increased and manpower cost is greatly saved; and production efficiency is high and production cost is low.

Description

Technical field [0001] The invention relates to the technical field of electronic products, in particular to a glue spraying process for flexible circuit boards. Background technique [0002] The glue spraying process of the existing flexible circuit board is to cut the entire flexible circuit board into strips of light after being patched (there are dozens of strips after slitting), and then weld and splice into several meters. The tape is glued on the tooling one by one for spraying, which is low in production efficiency and consumes a lot of labor. Summary of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a glue spraying process for flexible circuit boards. [0004] The purpose of the present invention is achieved by the following technical solutions: a glue spraying process for flexible circuit boards, including the following steps: [0005] (1) Whole board patch: multiple flexibl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22H05K3/00
CPCH05K3/0097H05K3/22H05K2203/075H05K2203/0779
Inventor 李惠权朱兵兄
Owner DONGGUAN MARCO AUTOMATION MACHINERY