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A glue spraying process for flexible circuit boards

A technology of flexible circuit board and glue spraying, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc. It can solve the problems of low production efficiency and labor consumption, and achieve fast curing speed, good effect and good flame retardancy performance effect

Active Publication Date: 2018-12-28
DONGGUAN MARCO AUTOMATION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The glue spraying process of the existing flexible circuit board is to cut the whole board of the flexible circuit board into strips of lights (dozens of strips after cutting), and then weld and splice them into several meters, and then put the welded lights Sticking one by one to the tooling for glue spraying, the production efficiency is low and labor-intensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A glue spraying process for a flexible circuit board, comprising the steps of:

[0057] (1) Whole board patching: multiple flexible circuit boards are patched separately to obtain multiple LED flexible light boards;

[0058] (2) Whole board welding: Weld the ends of multiple LED flexible light boards sequentially to obtain the entire LED flexible light board;

[0059] (3) Glue spraying on the whole board: spray glue on the welded LED flexible light board.

[0060] In the step (3), the distance between the glue outlet of the glue spray and the LED flexible light board is 0.4mm, the glue spray pressure is 0.12MPa, the glue spray speed is 10cm / s, and the glue spray thickness is 0.3 mm.

[0061] In the step (3), the glue solution used for glue spraying includes the following raw materials in parts by weight:

[0062] 15 parts epoxy resin

[0063] 15 parts phenolic resin

[0064] Synthetic rubber 5 parts

[0065] Filler 5 parts

[0066] 1 part flame retardant

[0067] ...

Embodiment 2

[0079] The difference between this embodiment and the above-mentioned embodiment 1 is:

[0080] In the step (3), the distance between the glue outlet of the glue spray and the LED flexible light board is 0.5 mm, the glue spray pressure is 0.13 MPa, the glue spray speed is 12 cm / s, and the glue spray thickness is 0.35 mm.

[0081] In the step (3), the glue solution used for glue spraying includes the following raw materials in parts by weight:

[0082] 20 parts epoxy resin

[0083] 20 parts phenolic resin

[0084] 8 parts synthetic rubber

[0085] Filler 8 parts

[0086] Flame retardant 2 parts

[0087] Hardener 2 parts

[0088] 0.8 parts of curing accelerator

[0089] 0.8 parts of coupling agent

[0090] 90 parts of solvent.

[0091] The epoxy resin is a high heat-resistant epoxy resin.

[0092] The phenolic resin is a mixture of phenol-type phenolic resin and bisphenol A-type phenolic resin in a weight ratio of 1:0.8; the synthetic rubber is a mixture of styrene-but...

Embodiment 3

[0099] The difference between this embodiment and the above-mentioned embodiment 1 is:

[0100] In the step (3), the distance between the glue outlet of the glue spray and the LED flexible light board is 0.6mm, the glue spray pressure is 0.14MPa, the glue spray speed is 15cm / s, and the glue spray thickness is 0.4 mm.

[0101] In the step (3), the glue solution used for glue spraying includes the following raw materials in parts by weight:

[0102] 25 parts epoxy resin

[0103] 25 parts of phenolic resin

[0104] Synthetic rubber 10 parts

[0105] Filler 10 parts

[0106] 3 parts flame retardant

[0107] 3 parts curing agent

[0108] Curing accelerator 1 part

[0109] 1 part coupling agent

[0110] 100 parts of solvent.

[0111] The epoxy resin is a flame-retardant epoxy resin; the flame-retardant epoxy resin is a phosphorus-containing epoxy resin with a phosphorus weight content of 1%.

[0112] The phenolic resin is a mixture of phenol-type phenolic resin and bisphen...

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PUM

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Abstract

The invention relates to the electronic product technology field and especially relates to a glue spraying technology of a flexible circuit board. The technology comprises the following steps of (1) carrying out entire board paster: carrying out paster processing on a plurality of flexible circuit boards respectively so as to acquire a plurality of LED soft lamp plates; (2) carrying out entire board welding: successively welding heads and tails of the plurality of LED soft lamp plates so as to acquire an entire LED soft lamp plate; and (3) carrying out entire plate glue spraying: carrying out glue spraying processing on the welded LED soft lamp plates. In the invention, through adopting the entire board paster, the entire board welding and the entire plate glue spraying, an entire plate breadth of the LED soft lamp plates is wide so that glue spraying operation is easy to perform; and dozens of lamp bands can be sprayed at a time so that a glue spraying production capacity of the LED soft lamp plates is greatly increased and manpower cost is greatly saved; and production efficiency is high and production cost is low.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a glue spraying process for a flexible circuit board. Background technique [0002] The glue spraying process of the existing flexible circuit board is to cut the whole board of the flexible circuit board into strips of lights (dozens of strips after cutting), and then weld and splice them into several meters, and then put the welded lights Sticking one by one to the tooling for glue spraying, the production efficiency is low and it takes a lot of labor. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the object of the present invention is to provide a glue spraying process for flexible circuit boards. [0004] The purpose of the present invention is achieved through the following technical solutions: a glue spraying process for flexible circuit boards, comprising the steps of: [0005] (1) Whole board pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22H05K3/00
CPCH05K3/0097H05K3/22H05K2203/075H05K2203/0779
Inventor 李惠权朱兵兄
Owner DONGGUAN MARCO AUTOMATION MACHINERY