A glue spraying process for flexible circuit boards
A technology of flexible circuit board and glue spraying, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc. It can solve the problems of low production efficiency and labor consumption, and achieve fast curing speed, good effect and good flame retardancy performance effect
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Embodiment 1
[0056] A glue spraying process for a flexible circuit board, comprising the steps of:
[0057] (1) Whole board patching: multiple flexible circuit boards are patched separately to obtain multiple LED flexible light boards;
[0058] (2) Whole board welding: Weld the ends of multiple LED flexible light boards sequentially to obtain the entire LED flexible light board;
[0059] (3) Glue spraying on the whole board: spray glue on the welded LED flexible light board.
[0060] In the step (3), the distance between the glue outlet of the glue spray and the LED flexible light board is 0.4mm, the glue spray pressure is 0.12MPa, the glue spray speed is 10cm / s, and the glue spray thickness is 0.3 mm.
[0061] In the step (3), the glue solution used for glue spraying includes the following raw materials in parts by weight:
[0062] 15 parts epoxy resin
[0063] 15 parts phenolic resin
[0064] Synthetic rubber 5 parts
[0065] Filler 5 parts
[0066] 1 part flame retardant
[0067] ...
Embodiment 2
[0079] The difference between this embodiment and the above-mentioned embodiment 1 is:
[0080] In the step (3), the distance between the glue outlet of the glue spray and the LED flexible light board is 0.5 mm, the glue spray pressure is 0.13 MPa, the glue spray speed is 12 cm / s, and the glue spray thickness is 0.35 mm.
[0081] In the step (3), the glue solution used for glue spraying includes the following raw materials in parts by weight:
[0082] 20 parts epoxy resin
[0083] 20 parts phenolic resin
[0084] 8 parts synthetic rubber
[0085] Filler 8 parts
[0086] Flame retardant 2 parts
[0087] Hardener 2 parts
[0088] 0.8 parts of curing accelerator
[0089] 0.8 parts of coupling agent
[0090] 90 parts of solvent.
[0091] The epoxy resin is a high heat-resistant epoxy resin.
[0092] The phenolic resin is a mixture of phenol-type phenolic resin and bisphenol A-type phenolic resin in a weight ratio of 1:0.8; the synthetic rubber is a mixture of styrene-but...
Embodiment 3
[0099] The difference between this embodiment and the above-mentioned embodiment 1 is:
[0100] In the step (3), the distance between the glue outlet of the glue spray and the LED flexible light board is 0.6mm, the glue spray pressure is 0.14MPa, the glue spray speed is 15cm / s, and the glue spray thickness is 0.4 mm.
[0101] In the step (3), the glue solution used for glue spraying includes the following raw materials in parts by weight:
[0102] 25 parts epoxy resin
[0103] 25 parts of phenolic resin
[0104] Synthetic rubber 10 parts
[0105] Filler 10 parts
[0106] 3 parts flame retardant
[0107] 3 parts curing agent
[0108] Curing accelerator 1 part
[0109] 1 part coupling agent
[0110] 100 parts of solvent.
[0111] The epoxy resin is a flame-retardant epoxy resin; the flame-retardant epoxy resin is a phosphorus-containing epoxy resin with a phosphorus weight content of 1%.
[0112] The phenolic resin is a mixture of phenol-type phenolic resin and bisphen...
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