Camera module for preventing chip tilt and assembly method thereof
A technology for a camera module and an assembly method, which is applied in image communication, radiation control devices, components of color TVs, etc., can solve problems such as inconsistency, blurred imaging of the camera module, and impact on the imaging quality of the camera module.
Active Publication Date: 2022-03-29
NINGBO SUNNY OPOTECH CO LTD
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Problems solved by technology
Due to the deviation of the ink coverage of the circuit board 10P and the deviation of the etching precision of the welding pad, the size and position of the welding area of the circuit board 10P and the welding area on the photosensitive chip 20P are often inconsistent. When performing SMT (Surface Mount Technology, Surface Mount Technology) on the camera module, the amount of solder paste on each pad on the circuit board 10P has a certain difference, so that when the photosensitive chip 20 is mounted After the circuit board 10P, there will be a large inclination between the photosensitive chip 20P and the circuit board 10P. In severe cases, the inclination between the photosensitive chip 20P and the circuit board 10P can reach 50um. Once the inclination between the photosensitive chip 20P and the circuit board 10P is too large (for example, the inclination between the photosensitive chip 20P and the circuit board 10P exceeds the allowable margin of the lens of the camera module amount), it will directly lead to blurred imaging of the camera module, so that seriously affects the imaging quality of the camera module
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[0072] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.
[0073] Such as Figure 2 to Figure 5 Shown is the camera module provided according to the first preferred embodiment of the present invention, wherein the camera module includes a circuit board 10, a photosensitive chip 20, an optical lens 30 and other possible components.
[0074] Specifically, the optical lens 30 is arranged on the photosensitive path of the photosensitive chip 20, and the photosensitive chip 20 is electrically connected to the circuit...
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A camera module and its assembly method for preventing chip tilting, wherein the camera module includes a photosensitive chip; a circuit board; and at least one positioning element, wherein each positioning element is used to assemble the circuit board and the the photosensitive chip to prevent the photosensitive chip from tilting. Compared with the camera module in the prior art, the flatness of the photosensitive chip is not limited by the size of the connecting element and the size of the welding area between the photosensitive chip and the circuit board, thereby effectively improving the flatness of the photosensitive chip. The flatness of the photosensitive chip after assembly.
Description
technical field [0001] The present invention relates to an optical imaging device, in particular to a camera module and its assembly method, wherein the camera module includes a photosensitive chip and a circuit board. Compared with the camera module in the prior art, the photosensitive chip The flatness of the photosensitive chip is not limited by the size of the connecting element and the size of the soldering area between the photosensitive chip and the circuit board, thereby effectively improving the flatness of the photosensitive chip after assembly. Background technique [0002] With the rapid advancement of science and technology, electronic mobile devices represented by smartphones and tablet computers have been widely popularized. The application of electronic mobile devices has brought profound and far-reaching changes to people's lifestyles. [0003] At present, along with the development of these electronic mobile devices, camera modules for assisting users in qu...
Claims
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IPC IPC(8): H04N5/225H01L27/146
Inventor 张宝忠赵波杰王明珠李建军
Owner NINGBO SUNNY OPOTECH CO LTD