A focused shock wave excitation device for non-contact excitation of mems microstructure

A non-contact, excitation device technology, applied in microstructure devices, microstructure technology and other directions, can solve the problems of difficult dynamic characteristic parameters of microstructures, and achieve the effect of easy dynamic characteristic parameters, easy testing, and good excitation effect.

Inactive Publication Date: 2017-07-28
BOHAI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the main disadvantage of this device is that the device uses an elastic base to excite the microstructure, so when the non-contact optical vibration measurement method is used to test the dynamic characteristics of the microstructure, the vibration response obtained The signal will inevitably contain the vibration response of the base structure, which will make it very difficult to obtain the dynamic characteristic parameters of the microstructure

Method used

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  • A focused shock wave excitation device for non-contact excitation of mems microstructure
  • A focused shock wave excitation device for non-contact excitation of mems microstructure
  • A focused shock wave excitation device for non-contact excitation of mems microstructure

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Embodiment Construction

[0027] Such as Figure 1-Figure 8 As shown, the present invention relates to a focused shock wave excitation device for non-contact excitation of MEMS microstructures, including a substrate 1, on which a manual three-axis displacement table 9 and a support 4 are arranged, and the manual three-axis The axial displacement stage 9 is installed on a bottom plate 2, and the bottom plate 2 is fixed on the base plate 1 by screws. A microstructure unit 6 is provided on the Z-axis slide plate 8 of the manual three-axis displacement table 9; the microstructure unit 6 includes a mounting sleeve 601 installed on the Z-axis slide plate 8 through a horizontal support 3, and The mounting sleeve 601 is provided with a stepped mounting hole, and a MEMS microstructure 605 is installed at the bottom of the mounting hole through a microstructure mounting plate 607; the microstructure mounting plate 607 is fixed in the mounting hole by screws 606 uniformly distributed around the circumference On ...

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Abstract

The invention discloses a focused shock wave excitation device for non-contact excitation of MEMS microstructures, which includes a substrate, on which a manual three-axis displacement platform and a support are arranged, and a Z-axis sliding plate of the manual three-axis displacement platform There is a microstructure unit; the upper end of the support is provided with an ellipsoid cavity whose inner cavity is half an ellipsoid, the first focus of the ellipsoid is located in the ellipsoid cavity, and the microstructure unit is located on the side of the second focus of the ellipsoid; A needle electrode unit is provided on the ellipsoid cavity; the two needle electrodes are respectively electrically connected to the two poles of the high-voltage capacitor, and a first air switch is arranged between the high-voltage capacitor and one needle electrode, and the distance between the needle tips of the two needle electrodes is less than that of the high-voltage capacitor. The maximum air breakdown gap after the capacitor is fully charged; the high-voltage capacitor is electrically connected to the positive and negative poles of the high-voltage power supply. The beneficial effect is that the device can avoid the interference of the vibration response of the base structure on the test results, realize the non-contact excitation of the MEMS microstructure, have good excitation effect, and facilitate the acquisition of the dynamic characteristic parameters of the microstructure.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, in particular to a focused shock wave excitation device for non-contact excitation of MEMS microstructures. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is first necessary...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C99/00
CPCB81C99/0035
Inventor 佘东生杨一柳魏泽飞杨祯山赵辉
Owner BOHAI UNIV
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