Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A non-contact excitation device for mems microstructure based on shock wave

A kind of excitation device, non-contact technology, applied in the direction of microstructure device, microstructure technology, etc., can solve the problems of difficult dynamic characteristic parameters of microstructure, achieve the effect of good excitation effect, improve vibration excitation ability, and avoid interference

Inactive Publication Date: 2017-11-10
BOHAI UNIV
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the main disadvantage of this device is that the device uses an elastic base to excite the microstructure, so when the non-contact optical vibration measurement method is used to test the dynamic characteristics of the microstructure, the vibration response obtained The signal will inevitably contain the vibration response of the base structure, which will make it very difficult to obtain the dynamic characteristic parameters of the microstructure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A non-contact excitation device for mems microstructure based on shock wave
  • A non-contact excitation device for mems microstructure based on shock wave
  • A non-contact excitation device for mems microstructure based on shock wave

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] like Figure 1-Figure 3 As shown, a shock-based MEMS microstructure non-contact excitation device related to the present invention includes a substrate 1, on which a manual three-axis translation platform 2 and a support 4 are arranged, and the manual three-axis translation platform 2 is installed on a bottom plate 10, which is fixed on the base plate 1 by screws. A microstructure unit 3 is provided on the Z-axis slide plate 8 of the manual three-axis displacement table 2;

[0031] like Figure 7-Figure 9 As shown, the microstructure unit 3 includes a mounting sleeve 301 installed on the Z-axis slide plate 8 through a horizontal support 9, and a stepped first mounting hole is provided in the mounting sleeve 301. In the first mounting hole The inner bottom is equipped with a MEMS microstructure 305 through a microstructure mounting plate 307; A through hole corresponding to the small hole at the bottom of the first installation hole is provided on the upper surface, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a MEMS microstructure non-contact excitation device based on shock waves, which includes a substrate, a manual three-axis displacement platform and a support, and a microstructure unit is arranged on the manual three-axis displacement platform; The inner cavity is an ellipsoid cavity of half an ellipsoid surface, and a first needle electrode unit is arranged on one side of the ellipsoid cavity, and the tip of the first needle electrode points to the first focal point; the microstructure unit is located on the second side of the ellipsoid surface. At the focal point; on the other side of the ellipsoid cavity, a second needle electrode unit is provided, and the needle tip of the second needle electrode points to the first focus of the ellipsoid; the first and second needle electrodes are respectively electrically connected to the two poles of the high-voltage capacitor, A first air switch is provided between the high-voltage capacitor and the first needle electrode; the two poles of the high-voltage capacitor are respectively electrically connected to the positive and negative poles of the high-voltage power supply, and the on-off is controlled by the second air switch. The device can avoid the interference of the vibration response of the base structure on the test results, realizes the non-contact excitation of the MEMS microstructure, and has a good excitation effect.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a shock wave-based MEMS microstructure non-contact excitation device. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is first necessary to make ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B81C99/00
CPCB81C99/0035
Inventor 佘东生杨一柳赵玉峰尹作友赵辉
Owner BOHAI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products