Insulation warehouse for high-temperature materials and its 3D printer

Abstract

The invention discloses an insulation bin used for high-temperature materials. The insulation bin comprises a shell, two heating mechanisms, a printing platform and a Z-axis printing lifting platform. The front portion of the shell is provided with a door opening position. The two heating mechanisms are arranged on the left side and the right side in the shell correspondingly. The printing platform is located on the Z-axis printing lifting platform. The left side and the right side of the Z-axis printing lifting platform are movably connected with the left side and the right side in the shell. The Z-axis printing lifting platform drives the printing platform to move up and down in the Z-axis direction. The invention further discloses a 3D printer. The temperature in the insulation bin is increased through the heating mechanisms, the effect that the high-temperature materials are printed at high temperature is ensured, the phenomenon of edge warping deformation of a model is avoided, and meanwhile, the effect that working of an outer electric appliance is not influenced by the high-temperature environment is ensured.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a thermal insulation bin for high-temperature materials and a 3D printer thereof. Background technique [0002] In 3D printing, it is often necessary to use some high-temperature materials, such as: PA PC PPS PEEK PI, etc.; when used for printing, due to the shrinkage of the material, the material must be printed at high temperature, otherwise the model will warp and deform. If the model cannot be adhered to the layer and the model bursts, the printed model will be scrapped. Contents of the invention [0003] In view of this, the main purpose of the present invention is to provide a thermal insulation bin for high-temperature materials and its 3D printer, which can prevent warping and deformation of the model. [0004] In order to achieve the above object, technical solution of the present invention is achieved in that way: [0005] An embodiment of the presen...

AI Technical Summary

Problems solved by technology

[0002] In 3D printing, it is often necessary to use some high-temperature materials, such as: PA PC PPS PEEK PI, etc.; when used for printing, due to the shrinkage of the material, the material must be printed at high temperature, otherwise the model will warp and deform. Failure to stick to the layer and the model bursting, etc., resulting in the scrapping of the printed model

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