Electroplatable polyether imide material and preparation method thereof

Abstract

The invention relates to an electroplatable polyether imide material and a preparation method thereof. The electroplatable polyether imide material is prepared from the following components in percentages by weight: 70-85% of polyether imide PEI resin, 10-25% of a ceramic microbead abrasive material, 0.05-0.1% of a colloidizing auxiliary agent and 0.1-0.3% of polytetrafluoroethylene micropowder. The electroplatable polyether imide material provided by the invention can improve the flowability and machinability of a polyether imide plastic by adding the ceramic microbead abrasive material, and the mechanical strength and the temperature resistance are obviously improved; a metal plating and the surface of the polyether imide plastic are combined well and the dimensional stability of the polyether imide plastic product is improved, so that the coefficient of thermal expansion of the metal plating of the polyether imide plastic product is relatively reduced, and the problem that the plastic and the metal plating delaminate due to a temperature difference is effectively solved.

Description

technical field [0001] The invention relates to the technical field of plastics, in particular to an electroplatable polyetherimide material and a preparation method thereof. Background technique [0002] There are many types of plastics, but not all plastics can be electroplated. At present, the plastics used for electroplating in my country's market are mainly ABS plastics. However, the temperature resistance and strength of this material are very general, and the defects of strong burning smell lead to the main application of ABS plastics in household appliances, toys and other daily necessities through electroplating to the decorative field. [0003] Polyetherimide PEI can effectively reduce weight and cost because of its light weight, excellent low and high temperature resistance, high strength and good dimensional stability. Through injection molding molds, complex product structures can be realized, which can fully meet the requirements of avionics. Connectors, sate...

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Problems solved by technology

The formation of a conductive layer has to go through several steps such as roughening, neutralization, sensitization, activation, and chemical plating, which is much more complicated than metal electroplating, and problems are prone to occur in electroplating production

At present, the bonding force between polyetherimide PEI plastics and electroplated metal layer nickel Ni in the domestic market is very poor, and electroplating is very difficult; and some physical properties of polyetherimide PEI and metal coatings, such as the expansion coefficient, are too large to be used at high temperatures. It is difficult to ensure the stability of the coating in a poor environment

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