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Backlight structure, display panel and display device

A backlight and backplane technology, which is applied to the structure of telephones, telephone communications, electrical components, etc., can solve problems that affect user experience, affect the overall taste of the backlight, yellowing of film materials, light guide plates, etc., and reduce the loss of LED brightness Effect

Active Publication Date: 2017-06-20
BEIJING JINGDONGFANG CHAGU ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive temperature may cause yellowing of the film material and light guide plate, warping of the film material; affect the overall taste of the backlight; affect the user experience; shorten the life of the backlight, etc.

Method used

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  • Backlight structure, display panel and display device
  • Backlight structure, display panel and display device
  • Backlight structure, display panel and display device

Examples

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Embodiment Construction

[0021] The embodiment of the present application provides a backlight structure, a display panel and a device, which are used to connect the FPC to the backplane through a heat-conducting glue, so as to achieve the effect of accelerating the heat dissipation in front of the lamp.

[0022] see figure 1 , a backlight structure provided by an embodiment of the present application includes a backplane 001 and a flexible circuit board FPC003, and the FPC 003 is connected to the backplane 001 through a thermally conductive glue 002.

[0023] Since the thermal conductivity of the backplane is better, in the embodiment of the present application, the FPC is connected to the backplane through a heat-conducting glue, which can achieve the effect of accelerating the heat dissipation in front of the lamp.

[0024] Among them, the reason why the fast heat dissipation of FPC can be achieved is mainly because after the light bar is assembled, the FPC is in direct contact with the backlight b...

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PUM

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Abstract

The invention discloses a backlight structure, a display panel and a display device. A flexible printed circuit (FPC) is connected with a backplane through heat conduction glue, thereby achieving an effect of facilitating heat dissipation before lamps. The backlight structure provided by the invention comprises the backplane and the FPC, and the FPC is connected with the backplane through the heat conduction glue. The backplane has better thermal conductivity, so that the FPC is connected with the backplane through the heat conduction glue, which can achieve the effect of facilitating the heat dissipation before the lamps.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a backlight structure, a display panel and a device. Background technique [0002] With the continuous improvement of market requirements for smart phones, the backlight, as the provider of light sources for smart phones, has higher and higher market requirements for it. The overall development trend of backlight is roughly bright, high and thin, and narrow bezel. As the brightness increases, the temperature in front of the lamp also increases. Excessively high temperature may cause yellowing of the film and light guide plate, warping of the film; affect the overall taste of the backlight; affect the user experience; shorten the life of the backlight and other problems. How to quickly dissipate heat has become an urgent problem to be solved. Contents of the invention [0003] The embodiment of the present application provides a backlight structure, a display panel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
CPCH04M1/026H04M1/0266
Inventor 韦丽李文军
Owner BEIJING JINGDONGFANG CHAGU ELECTRONICS
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