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Product acceptance system and product acceptance method

A product and judgment module technology, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as low efficiency, and achieve the effect of avoiding time-consuming and laborious, shortening testing time, and improving testing quality

Active Publication Date: 2017-06-27
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] The purpose of the present invention is to provide a product acceptance system and a

Method used

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  • Product acceptance system and product acceptance method
  • Product acceptance system and product acceptance method
  • Product acceptance system and product acceptance method

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Embodiment Construction

[0041] The product acceptance system and product acceptance method of the present invention will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is shown, and it should be understood that those skilled in the art can modify the present invention described here and still implement the present invention beneficial effect. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0042] In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrat...

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Abstract

The invention discloses a product acceptance system and a product acceptance method. The product acceptance system provided by the invention comprises a detection module and a judgment module, wherein the judgment module decides detention and release of the product according to a detection result of the detection module; the detection module comprises multiple sub modules; in a condition in which the former sub module completes operation and the detection result of the former sub module is normal, the next sub module operates to detect the product; and in a condition in which the detection result of any sub module is abnormal, the judgment module decides detention of the product, and in a condition in which the detection result of any sub module is normal, the judgment module decides release of the product. Compared with the prior art, when the product acceptance system of the invention is used for product acceptance, the phenomenon that manual detection is time-consuming and labor-consuming is avoided, the detection time is shortened, and the detection quality is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a product acceptance system and a product acceptance method. Background technique [0002] After the wafer (wafer) is manufactured, the wafer needs to be tested by probe probe (CP). During CP testing, wafers are held at each step for inspection by technicians. The technician will check one wafer or multiple wafers at the same time according to the test results, and decide whether it can be released to the next step. [0003] like figure 1 As shown, the current inspection methods for wafers during CP testing include: [0004] Step S1, obtaining the wafer detained by the MES (Manufacturing Execution System); [0005] Step S2, checking the detection pattern; [0006] Step S3, checking the yield rate; [0007] Step S4, comparing known graphics; [0008] Step S5, release. [0009] Specifically, technicians get a bunch of detained wafers, and first inspect them according...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L22/10H01L22/14H01L22/34
Inventor 张明华徐娟娟
Owner SEMICON MFG INT (SHANGHAI) CORP