Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

A metal bonding and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as increasing the delay time of the assembly process, inability to produce on a large scale, and increasing the cost of the assembly process

Active Publication Date: 2017-07-14
AMKOR TECH INC
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Direct metal-to-metal bonding (e.g., copper-to-copper (Cu-Cu) bonding, etc.) does not require the use of solder; Complicates the assembly process, increases the cost of the assembly process, and increases the delay time of the assembly process, so these joints cannot be mass-produced in a cost-effective process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
  • Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
  • Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The following discussion presents aspects of the invention by providing examples of the invention. These examples are non-limiting, and thus, the scope of the inventive concepts should not be limited by any specific features of the examples provided herein. In the discussion that follows, the phrases "for example," "exemplary," etc. are non-limiting and generally synonymous with "by way of example, but not in a limiting sense."

[0017] As used herein, "and / or" means any one or more of the items in a list joined by "and / or". For example, "x and / or y" means any element in the three-element set {(x), (y), (x,y)}. In other words, "x and / or y" means "one or both of x and y". In another example, "x, y, and / or z" means a set of seven elements {(x), (y), (z), (x, y), (x, z), (y, z), (x,y,z)} any element. In other words, "x, y, and / or z" means "one or more of x, y, and z".

[0018] The terminology used herein is for the purpose of describing particular examples only and is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semiconductor product with interlocking metal-to-metal bonds and a method for manufacturing thereof. A structure and method for performing metal-to-metal bonding in an electrical device are provided. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.

Description

technical field [0001] The present invention relates to semiconductor products with interlocking metal-to-metal junctions and methods of making the same. Background technique [0002] Existing methods for forming electrical connections, such as those used in integrated circuits, have disadvantages. Soldering, for example, is common; however, solder has a relatively low melting point, which imposes temperature constraints on subsequent processing steps and the final product. In addition, solder atoms also have a tendency to migrate along copper joints, thereby changing the electrical and mechanical properties of the soldered joints as they age. Direct metal-to-metal bonding (e.g., copper-to-copper (Cu-Cu) bonding, etc.) does not require the use of solder; This complicates the assembly process, increases the cost of the assembly process, and increases the delay time of the assembly process, so that these bonds cannot be mass-produced with a cost-effective process. Contents...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/538H01L21/768
CPCH01L21/76895H01L23/5386H01L24/16H01L2224/16145H01L2224/81385H01L2225/06513H01L24/11H01L24/13H01L2224/0401H01L2224/81005H01L2224/94H01L2224/05582H01L2224/05666H01L2224/13018H01L2224/16148H01L2224/16238H01L2224/32145H01L2224/32225H01L2224/73104H01L2224/73204H01L2224/81203H01L2224/92125H01L2224/97H01L2224/03912H01L2224/03914H01L2224/81141H01L2224/05572H01L2224/8134H01L2224/0558H01L2224/0345H01L2224/03452H01L2224/03462H01L2224/03464H01L2224/0347H01L2224/0508H01L2224/05082H01L2224/05124H01L2224/05139H01L2224/05144H01L2224/05155H01L2224/05573H01L2224/05575H01L2224/05647H01L2224/05671H01L2224/1147H01L2224/13155H01L2224/16055H01L24/81H01L25/50H01L25/0657H01L2224/13147H01L24/05H01L2224/05147H01L2224/81H01L2224/11H01L2924/01028H01L2924/013H01L2924/00014H01L2924/01074H01L2924/00H01L2224/16225H01L24/14H01L2224/81898H01L2224/1405H01L24/03H01L25/105H01L2224/05558H01L2224/05583H01L2224/80203
Inventor 波拉·巴洛葛卢可陆提斯·史温格骆·休莫勒
Owner AMKOR TECH INC