Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of coa substrate and its preparation method, display device

A technology of substrate and display area, applied in semiconductor/solid-state device manufacturing, instruments, semiconductor devices, etc., can solve the problems of non-patterning of insulating layer 20 and increased cost, etc.

Active Publication Date: 2020-02-28
BOE TECH GRP CO LTD +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the connection pattern 40 can be fully contacted with the signal line lead 10 in this way, since the insulating layer 20 is not patterned in the prior art, if the via hole 201 is to be formed at the part of the insulating layer 20 located in the wiring area, an additional Adds a second mask, which leads to an increase in cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of coa substrate and its preparation method, display device
  • A kind of coa substrate and its preparation method, display device
  • A kind of coa substrate and its preparation method, display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041] An embodiment of the present invention provides a COA substrate, such as image 3 As shown, including display area 01 and wiring area 02, as shown in Figure 4(a), Figure 4(b), Figure 5(a), Figure 5(b) and Figure 6(a)-Figure 6(c) , the COA substrate includes a first conductive layer, an insulating layer 20 , a second conductive layer, a flat layer 30 and a connection pattern 40 sequentially disposed on the base substrate.

[0042] The first conductive la...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Embodiments of the present invention provide a COA substrate, a preparation method thereof, and a display device, which relate to the field of display technology, and can ensure contact between a connection pattern and a signal line lead without increasing production costs. The disclosed COA substrate includes a first conductive layer, an insulating layer, a second conductive layer, a flat layer, and a connection pattern arranged in sequence; the first conductive layer includes signal wire leads located in the wiring area; the part of the insulating layer located in the wiring area has a second A via hole to expose the signal line leads; the second conductive layer includes a first metal pattern located in the wiring area and a second metal pattern located in the display area, the first metal pattern has a second via hole; the flat layer is located in the part of the wiring area There is a hollowed out area, the second via hole is at least partially located in the hollowed out area, and the projection of the boundary of the second via hole located in the hollowed out area on the base substrate overlaps with the projection of the boundary of the first via hole on the base substrate; The pattern is located in the wiring area, and the connection pattern passes through the first via hole and the second via hole to be connected with the signal line leads.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a COA substrate, a preparation method thereof, and a display device. Background technique [0002] COA (Color Filter on Array) substrate means that the color film layer is directly prepared on the array substrate. Since the display panel using the COA substrate does not have the problem of alignment between the color filter substrate and the array substrate, it can reduce the difficulty of box alignment during the production process of the display panel and avoid errors in box alignment. Therefore, the black matrix can be designed to be narrower. Thereby improving the pixel aperture ratio. [0003] However, since the color film layer is prepared on the array substrate, it will cause a large gap on the surface of the array substrate, which may affect the preparation of the subsequent process. In the prior art, by adding a flat layer, the flat layer can be, for example, an organi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/124H01L27/1259G02F1/136286G02B5/201G02F1/136222G02F1/1362G02F1/13458G02F1/13452
Inventor 许志财张逵李辉刘梦秋
Owner BOE TECH GRP CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More