Heat radiation unit

Abstract

The invention provides a heat radiation unit which comprises an integratedly formed body which has a first cavity and at least one second cavity which is adjacent to the first cavity and does not communicate with the first cavity. The first cavity is filled with a first working fluid and is defined as a first heat radiating part, the second cavity is filled with a second working fluid and is defined as a second heat radiating part, and the first heat radiating part is correspondingly connected to the second heat radiating part. Through the design of the structure of the invention, the heat radiation unit has the functions of large area heat radiation and far end heat conduction, and the production cost can be greatly reduced.

Description

[0001] 【Technical field】 [0002] The invention relates to a heat dissipation unit, especially a heat dissipation unit which can greatly reduce the production cost and has the functions of large-area heat dissipation and remote heat conduction at the same time. [0003] 【Background technique】 [0004] By the way, with the advancement of semiconductor technology, the volume of integrated circuits is gradually shrinking. In order to enable integrated circuits to process more data, integrated circuits with the same volume can accommodate several times more than before. Computing elements, when the number of computing elements in the integrated circuit increases, the execution efficiency becomes higher and higher, so the heat energy generated by the computing elements is also increasing. Taking the common central processing unit as an example, at high full load When the workload is high, the heat emitted by the central processing unit is enough to burn the entire central processing...

AI Technical Summary

Problems solved by technology

[0006] However, since known heat dissipation elements such as heat pipes and vapor chambers are heat dissipation elements with a single solution (only a single temperature uniformity or long-distance heat conduction), in other words, known heat dissipation elements arranged in electronic equipment can only be used for heat pipes Or conduct heat conduction or heat dissipation at the position where the vapor chamber contacts the heat source, and cannot have the effect of uniform temperature and remote heat dissipation at the same time. Of course, the heat exchange efficiency is relatively poor

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