Panel fitting device and processing method thereof
A technology of lamination device and processing method, applied in the direction of lamination device, chemical instrument and method, layered products, etc., can solve the problems of dislocation lamination, easy deviation of lamination position, easy generation of air bubbles, etc., and achieve stable lamination. Effect
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[0020] In order to illustrate the technical problems, technical solutions and beneficial effects to be solved by the panel bonding device and its processing method provided by the present invention more clearly and clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0021] refer to figure 1 , figure 1 It is a schematic diagram of a panel bonding device according to a preferred embodiment of the present invention. The panel bonding device provided by the present invention is used to bond a flexible substrate 10 and a first film layer 11. The flexible substrate 10 is usually attached to a hard cover plate 20. The above flexible substrate 10 and cover plate 20 can be It is made of transparent materials such as glass and resin, and the two are ...
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