Glue filling method, equipment and system for circuit board and computer storage medium
A circuit board and glue filling technology, which is applied in printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve problems affecting product quality, voids or white spots, and partial lack of glue.
Active Publication Date: 2017-09-12
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
However, due to the uniformity of pattern distribution, the amount of glue required for areas with sparse line distribution is much greater than that required for areas with densely distributed lines
Especially for circuit boards with a large area of copper-free area, if the above-mentioned requirements for the residual copper ratio of the entire board are met, there may also be local glue shortage problems, resulting in defects such as lamination delamination, voids or white spots, which affect product quality.
Method used
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[0047] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0048] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening ele...
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The invention relates to a glue filling method, equipment and system for a circuit board, and a computer storage medium. The glue filling method for the circuit board comprises the following steps: providing a PCB (printed circuit board) and a prepreg with a total glue amount P; acquiring an area S1 of a copper-free region on the PCB and a required residual copper rate C1 of the whole board; obtaining a flowing glue area S2 corresponding to the total glue amount P of the prepreg according to the total glue amount P of the prepreg; calculating a local residual copper rate C2=1-S1 / (S1+S2) corresponding to the copper-free region; and comparing the required residual copper rate C1 of the whole board with the local residual copper rate C2, if C1 is greater than or equal to C2, using the prepreg for glue filling. The glue filling equipment for the circuit board comprises an acquisition unit, an arithmetic unit, a calculation unit and a comparison unit. The glue filling method, equipment and system for the circuit board, and the computer storage medium provided by the invention can avoid a problem of local glue shortage on the circuit board, and ensure the quality of products.
Description
technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board glue filling method, equipment, system and computer storage medium. Background technique [0002] Lamination is a key link in the circuit board production process. The lamination quality of the circuit board has a direct impact on the production of the subsequent process and the reliability of the product. When using prepreg for glue filling, generally ensure that the difference between the total glue amount of the prepreg and the amount of glue required for the line gap is greater than or equal to a certain set value. However, due to the uniformity of pattern distribution, the amount of glue required for areas with sparse line distribution is much greater than that required for areas with densely distributed lines. Especially for circuit boards with a large area of copper-free area, if the above-mentioned residual copper ratio requirements of ...
Claims
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Login to View More IPC IPC(8): H05K3/46H05K3/36
CPCH05K3/368H05K3/4632H05K2203/0126H05K2203/068
Inventor 吴森李娟李艳国
Owner GUANGZHOU FASTPRINT CIRCUIT TECH